Intel 320028-001 manual Heatsink Fastener Assembly, Thermal Interface Material TIM

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Reference Thermal Solutions—Core™ 2 Duo Mobile Processors

6.5.1Keep Out Zone Requirements

The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawings.” Because it extends beyond the footprint of the device, it is critical for board designers to allocate space for the heatsink.

6.5.2Thermal Performance

The cPCI reference heatsink is an all copper (C1100) design, intended for applications where vertical space is limited. The heatsink has been tested at flow rates from 4 CFM to 24 CFM. For a 40 °C external ambient and 17W TDP, the heatsink is expected to meet the thermal performance needed when the air flow rate is at least 4 CFM.

Figure 11. cPCI Reference Heatsink Thermal Performance vs. Volumetric Flow Rate

6.6Heatsink Fastener Assembly

The reference solutions use a screw, spring, and back plate assembly to attach the heatsink to the PCB. The fastener assembly used on the reference heatsink must apply the load conditions described in Section 4.1, “Package Mechanical Requirements” . The fastener assembly must comply with all of the keep out zone requirements described in this document, and should not degrade the thermal performance of the reference heatsinks. Finally the fastener assembly should be designed to meet the reliability guidelines described in Section 8.0, “Reliability Guidelines” .

6.7Thermal Interface Material (TIM)

The thermal interface material provides improved conductivity between the die and heatsink. It is important to understand and consider the impact of the interface between the die and heatsink base to the overall thermal solution. Specifically, the bond line thickness, interface material area, and interface material thermal conductivity must be selected to optimize the thermal solution.

It is important to minimize the thickness of the thermal interface material (TIM), commonly referred to as the bond line thickness. A large gap between the heatsink base and the die yields a greater thermal resistance. The thickness of the gap is determined by the flatness of both the heatsink base and the die, plus the thickness of the thermal interface material, and the clamping force applied by the heatsink attachment method. To ensure proper and consistent thermal performance, the TIM and application process must be properly designed.

 

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008

TDG

Order Number: 320028-001

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Contents Thermal Design Guide JuneTDG Contents Figures TablesRevision History First Public releaseIntroduction Design FlowDefinition of Terms Definition of Terms Sheet 1Thermal Design Tool Availability Reference DocumentsDefinition of Terms Sheet 2 Package Information Maximum Allowed Component Temperature Thermal SpecificationsThermal Design Power Thermal Specifications for the Intel Core2 Duo processorPackage Keep Out Zones Requirements Mechanical SpecificationsPackage Mechanical Requirements Board Level Keep Out Zone RequirementsPrimary Side Keep Out Zone Requirements- Micro-FCPGA Primary Side Keep Out Zone Requirements- Micro-FCBGA Secondary Side Keep Out Zone Requirements Thermal Solution Requirements Thermal Solution CharacterizationEquation 3. Maximum Allowable Resistance Equation 4. Required Performance of the HeatsinkRequired Heatsink Thermal Performance Ψ JA TDPReference Thermal Solutions Atca Reference Thermal SolutionThermal Performance Keep Out Zone Requirements1U+ Reference Heatsink Keep Out Zone Requirements Heatsink Thermal Performance vs. Volumetric Airflow Rate Compact PCI Reference HeatsinkHeatsink Fastener Assembly Thermal Interface Material TIMHeatsink Orientation Heatsink Orientation Relative to Airflow DirectionAdditional Thermal Features Die Temperature MeasurementsPower Simulation Software Local Ambient Temperature Measurement GuidelinesActive Heatsink Measurements Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Reliability Guidelines Reliability RequirementsAppendix a Thermal Solution Component Suppliers Reference HeatsinkAppendix B Mechanical Drawings Mechanical DrawingsCore 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors AdvancedTCA* Reference Heatsink Assembly AdvancedTCA* Reference Heatsink Core 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors CompactPCI* Reference Heatsink Assembly CompactPCI* Reference Heatsink Reference Heatsink PCB Keep Out Requirements Sheet 1 Reference Heatsink PCB Keep Out Requirements Sheet 2 Reference Heatsink Assembly Reference Heatsink

320028-001 specifications

The Intel 320028-001 is a robust processor designed to meet the demands of both consumers and professionals. Built on Intel's advanced microarchitecture, this model showcases a blend of high performance, energy efficiency, and cutting-edge technology.

One of the standout features of the Intel 320028-001 is its impressive clock speed, which ensures rapid data processing capabilities. This processor is designed with multiple cores, allowing it to handle several tasks simultaneously without compromising performance. This multi-core architecture is particularly beneficial for applications that require heavy multitasking or resource-intensive activities such as gaming, video editing, and 3D rendering.

In terms of technology, the Intel 320028-001 leverages Intel’s Turbo Boost technology, which dynamically increases the processor's clock speed to optimize performance based on current workload demands. This results in an efficient balance between performance and power consumption, providing users with the necessary speed when needed while conserving energy during lighter tasks.

Another key characteristic of the Intel 320028-001 is its compatibility with Intel Hyper-Threading technology. This allows each core to handle two threads simultaneously, resulting in improved multitasking capabilities and enhanced performance for threaded applications. This feature is particularly advantageous for applications that can utilize parallel processing, significantly enhancing overall system responsiveness.

Additionally, the Intel 320028-001 utilizes Intel’s Smart Cache technology. This shared cache allows for quicker data access and efficient memory usage, further optimizing execution speeds and minimizing latency. The processor is also designed to work seamlessly with the latest in memory technologies, supporting DDR4 memory for increased bandwidth and improved overall system performance.

Security features in the Intel 320028-001 include Intel Software Guard Extensions (SGX), which provide hardware-based safeguards for sensitive information, an essential component for business applications and personal data protection.

Overall, the Intel 320028-001 stands out with a combination of high-performance specs, advanced features, and energy-efficient operation, making it an excellent choice for a wide range of computing needs. Whether for gaming, professional applications, or daily use, this processor offers the reliability and performance that users expect from Intel.
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