Hitachi HUS103073FL3800 specifications Temperature Limits unit C, Temperature Measurement Points

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7.4 Precautions on the off-line test or bench test

When the off-line test or bench test is performed the drive should be tightly fixed and cooled. The set-up should be similar to the actual system configuration.

7.5 Cooling of the drive

Keep the drive (HDA and PCB) cool by using a FAN. Reliability and life of the drive increases as the temperature is lower.

Caution

7.6 Reliability temperature

The temperature measurement points and temperature limits are shown below.

1.The maximum temperature assures the data reliability, seek error rate, and must not be exceeded.

2.The reliability temperature maintains the MTBF of the drive and must not be exceeded in order to ensure its reliability. MTBF is also based on a nominal voltage condition.

3.The maximum temperature of HDA includes momentary temperature rise. Average temperature of HDA has to be less than this temperature.

Table 7.1 Temperature Limits (unit: °C)

Measurement points

 

HDA(top)

HDA(bottom)

IC(RW)

 

IC(MPU)

 

Maximum temperature

65

65

 

85

 

 

85

 

Reliability temperature

50

50

 

70

 

 

70

 

 

 

 

 

 

 

 

HDA(top)

 

 

 

 

IC(RW)

 

HDA(bottom)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IC(MPU)

Figure 7.4 Temperature Measurement Points

Drawing No. Sheet No. Revision

K6610091

26/43

2005/2/23

Image 26
Contents Hitachi Global Storage Technologies K6610091 2005/2/23 Influence for environment General cautions for safetyHeadline of safety caution Safety cautions for this product Warranty and Limited Liability Table of Contents Page Features ModelsStandards and Related Documents Characteristics DescriptionEnvironmental conditions and reliability ConditionsVibration test direction Shock test direction Power measurement Operating DC power Interface DC Power RequirementCurrent transition for +12V Start and Stop timePage Connecting Methods Cabling layout Wide LVD drivePage Scsi Interface Page Scsi Commands Supported Mounting and Handling OrientationsHDA upper surface Spacer PCB parts side 25/43 2005/2/23 Temperature Limits unit C Temperature Measurement PointsPrecautions for handling Maintenance Interface connectors Physical interfaceInterface cable WIDE, Single-ended mode Interface cable WIDE, LVD modeConnector Layout Wide LVD drive Connector Layout SCA-2 LVD drive Connector Signal Name Contact Conductor Pin assignmentPin assignment of Scsi Bus Connector C1 WIDE, LVD mode Diffsens Pin assignment of Scsi Bus Connector C1 SCA-2, LVD mode ATN +ATNPin assignment of Auxiliary Connector C4 Wide LVD drive Pin assignment of Option Jumper Connector C3 Wide LVD driveJumper Socket setting Jumper connector layout Wide LVD driveScsi ID Wide LVD Wide LVD Enable Delayed Start Scsi bus Terminator Power Extension connector Jumper socket