AMD 10 manual 256K L2 Cache Specifications

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31994A —1August 2004

AMD Sempron™ Processor Model 10 with 256K L2 Cache Data Sheet

6333 FSB AMD Sempron™ Processor Model 10 with

256K L2 Cache Specifications

This chapter describes the electrical specifications that are unique to the advanced 333 front - side bus (FSB) AMD Sempron™ Processor Model 10 with 256K L2 cache.

6.1Electrical and Thermal Specifications for the AMD Sempron™ Processor Model 10 with 256K L2 Cache

Table 1 shows the electrical and thermal specifications in the

C0 working state and the S1 Stop Grant state for this processor.

Table 1. Electrical and Thermal Specifications for the AMD Sempron™ Processor Model 10 with 256K L2 Cache

		VCC_CORE	ICC (Processor Current)				Thermal Power		5
	Frequency in MHz									Maximum Die
					Stop Grant S11, 2, 3, 4
		(Core	Working State C0
	(Model Number)	(Core	Working State C0							Temperature
	(Model Number)	Voltage)								Temperature
		Voltage)	Maximum	Typical	Maximum	Typical	Maximum	Typical
			Maximum	Typical	Maximum	Typical	Maximum	Typical

	1500 (2200+)	1.60 V	38.75 A	30.9 A	8.10 A	4.94 A	62.0 W	49.4 W		90°C

	2000 (2800+)
	2000 (2800+)

Notes:

1.See Figure 3, "AMD Sempron™ Processor Model 10 Power Management States" on page 9.

2.The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified current.

3.These currents occur when the AMD Athlon™ system bus is disconnected and has a low power ratio of 1/8 for Stop Grant disconnect and a low power ratio of 1/8 Halt disconnect applied to the core clock grid of the processor as dictated by a value of 2003_1223h programmed into the Clock Control (CLK_Ctl) MSR. For more information, refer to the AMD Athlon™ and

AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.

4.The Stop Grant current consumption is characterized at 50°C and not tested.

5.Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or

instruction sequences under normal system operation at nominal VCC_CORE . Thermal solutions must monitor the temperature of the processor to prevent the processor from exceeding its maximum die temperature.

Chapter 6

333 FSB AMD Sempron™ Processor Model 10 with 256K L2 Cache Specifications

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Contents Data Sheet Advanced Micro Devices, Inc. All rights reserved Table of Contents Mechanical Data Ordering Information AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet List of Figures Typical AMD Sempron Processor Model 10 System Block DiagramViii List of Tables List of Tables Date Rev Description Revision HistoryXii Overview Chapter QuantiSpeed Architecture Summary Typical AMD Sempron Processor Model 10 System Block Diagram Interface Signals Signaling TechnologyOverview Push-Pull PP Drivers AMD Athlon System Bus SignalsProcessor Model Logic Symbol DiagramFrequency Control Front-Side Bus Autodetect Legacy DiodeAMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet Power Management States Power ManagementHalt State Working StateChapter Power Management Connect Protocol Probe StateAMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet Procrdy Exiting the Stop Grant State and Bus Connect Sequence Connect State DiagramDisconnect request Connect Pending Disconnect Disconnect4/CReturn internal clocks to full speed and assert Northbridge Clock Control Cpuid Support AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet 256K L2 Cache Specifications Parameter Description Minimum Maximum Clock FrequencyDuty Cycle 333 FSB AMD Athlon System Bus AC Characteristics FSB AMD Athlon System Bus DC Characteristics 333 FSB AMD Athlon System Bus DC CharacteristicsInterface Signal Groupings Interface Signal GroupingsElectrical Data ConventionsVoltage Identification VID40 VID40 DC CharacteristicsFID30 DC Characteristics Vcca AC and DC CharacteristicsFrequency Identification FID30 DecouplingVcccore AC and DC Characteristics Vcccore CharacteristicsVcccore Voltage Waveform Absolute Ratings Absolute RatingsSysclk and SYSCLK# DC Characteristics Sysclk and SYSCLK# DC CharacteristicsGeneral AC and DC Characteristics General AC and DC CharacteristicsSignal Rise Time Sync Input Setup TimeSignal Fall Time Sync Input Hold Time50 Ω ±3% Open-Drain Pin IOL = Output Current2 Open Drain Test CircuitCharacteristics Thermal Diode CharacteristicsThermal Diode Electrical Characteristics Thermal DiodeAMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet Apic Pins AC and DC Characteristics Apic Pin AC and DC CharacteristicsGuidelines for Platform Thermal Protection of the Processor Hold Time Setup TimePower-Up Requirements Signal and Power-Up RequirementsPwrok AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet Processor Warm Reset Requirements Clock MultiplierSelection FID30 Die Loading Mechanical DataMechanical Loading Location Dynamic MAX Static MAX Units Die Surface 100453 Letter or Minimum MaximumChapter Mechanical Data Dimension 49.27 49.78 D1/E1 45.72 BSC 917 REF 42 REF 977 Chapter Mechanical Data AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet Pin Descriptions Pin Diagram and Pin Name AbbreviationsModel AMD Sempron Processor AMD Sempron Processor Model 10 Pin Diagram-Bottomside ViewPin Name Abbreviations AA31 Abbreviation Full Name Pin Q31 S31 U31 U37 W31 Y31 Y33AC31 AD30AJ35 AE33AG37 AL33J35 W33E27 E15F28 F24F32 F34AK36 AK34AM10 AM14V32 V30V34 V36Pin List Pin Name Cross-Reference by Pin LocationNo Pin A35 SDATA40# A37 SDATA30#E29 SDATA33# E31 SDATA32# Pin Name SDATA52# E11 SDATA50# E13 SDATA49# E15E33 NC Pin E35 SDATA31# E37 SDATA22# NC Pin F10H28 NC Pin H30 H32 H34 NC Pin H10 H12NC Pin VID4 J31 J33 SDATA19# J35 J37 SDATA29#S31 NC Pin S33 Key Pin Q31 NC Pin Q33 SDATA24# Q35 SDATA17# Q37 SDATA16#S35 SDATA15# S37 U31 NC Pin U33NC Pin W31 W33 FID0 FID1FID2 FID3 NC Pin Key Pin Y31 Y33 Y35 Y37 SDATA12#AE31 NC Pin AE33 NC Pin AD30 AD32NC Pin AF10 AF12 AF20NC Pin AJ11 AJ13 Analog AJ15 AJ17 AJ19 AJ21 AH30 FSBSense1 AH32AJ27 NC Pin AJ29 NC Pin AK10NC Pin AM10 AL25 NC Pin AL27 AL29NC Pin AN11 AN13 AN25 NC Pin AN27 AN29Detailed Pin Descriptions COREFB# Pins Sysclk PinsPins Connect PinFID30 Clock Multiplier Encodings FID30 PinsFLUSH# Pin Front-Side Bus Sense Truth TableIGNNE# Pin INIT# PinK7CLKOUT# Pins Jtag PinsKey Pins NC PinsScan Pins SADDOUT10# PinsThermdc Pins Pwrok PinVID40 Pins Vrefsys PinVID40 Code to Voltage Definition ZN and ZP Pins AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet Standard AMD Sempron Processor Model 10 Products Ordering InformationAMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet Constants and Variables for the Ideal Diode Equation Ideal Diode EquationTemperature Offset Correction ⎛--- I-- high------ ⎞ AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet Appendix B Signals and BitsData Terminology Abbreviations and Acronyms AbbreviationsAbbreviation Meaning API AcronymsNMI VGA Related Publications AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet

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