Analog Devices ADSP-2186 specifications WR Low

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ADSP-2186

ABSOLUTE MAXIMUM RATINGS*

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Input Voltage . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Output Voltage Swing . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range (Ambient) . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Lead Temperature (5 sec) TQFP . . . . . . . . . . . . . . . +280°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD SENSITIVITY

The ADSP-2186 is an ESD (electrostatic discharge) sensitive device. Electrostatic charges readily accumulate on the human body and equipment and can discharge without detection. Permanent damage may occur to devices subjected to high energy electrostatic discharges.

The ADSP-2186 features proprietary ESD protection circuitry to dissipate high energy discharges (Human Body Model) per method 3015 of MIL-STD-883. Proper ESD precautions are recom- mended to avoid performance degradation or loss of functionality. Unused devices must be stored in conductive foam or shunts, and the foam should be discharged to the destination before devices are removed.

WARNING!

ESD SENSITIVE DEVICE

ADSP-2186 TIMING PARAMETERS

GENERAL NOTES

Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others. While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, you cannot meaningfully add up parameters to derive longer times.

TIMING NOTES

Switching characteristics specify how the processor changes its signals. You have no control over this timing—circuitry external to the processor must be designed for compatibility with these signal characteristics. Switching characteristics tell you what the processor will do in a given circumstance. You can also use switching characteristics to ensure that any timing requirement of a device connected to the processor (such as memory) is satisfied.

Timing requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read operation. Timing requirements guarantee that the proces- sor operates correctly with other devices.

MEMORY TIMING SPECIFICATIONS

The table below shows common memory device specifications and the corresponding ADSP-2186 timing parameters, for your convenience.

Memory

ADSP-2186

Timing

Device

Timing

Parameter

Specification

Parameter

Definition

 

 

 

Address Setup to

tASW

A0–A13, xMS Setup

Write Start

 

before WR Low

Address Setup to

tAW

A0–A13, xMS Setup

Write End

 

before WR Deasserted

Address Hold Time

tWRA

A0–A13, xMS Hold before

 

 

WR Low

Data Setup Time

tDW

Data Setup before WR

 

 

High

Data Hold Time

tDH

Data Hold after WR High

OE to Data Valid

tRDD

RD Low to Data Valid

Address Access Time

tAA

A0–A13, xMS to Data

 

 

Valid

 

 

 

xMS = PMS, DMS, BMS, CMS, IOMS.

FREQUENCY DEPENDENCY FOR TIMING

SPECIFICATIONS

tCK is defined as 0.5 tCKI. The ADSP-2186 uses an input clock with a frequency equal to half the instruction rate: a 16.67 MHz

input clock (which is equivalent to 60 ns) yields a 30 ns proces- sor cycle (equivalent to 33 MHz). tCK values within the range of

0.5tCKI period should be substituted for all relevant timing para- meters to obtain the specification value.

Example: tCKH = 0.5 tCK – 7 ns = 0.5 (30 ns) – 7 ns = 8 ns

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Contents General Description Functional Block DiagramGeneral Note Architecture Overview Development SystemAdditional Information Serial Ports PIN DescriptionsMemory Interface Pins Input Pin Name Pins Output FunctionCommon-Mode Pins Setting Memory ModeSource Of Interrupt Interrupt Vector Address Hex LOW Power OperationPower-Down InterruptsSlow Idle Idle nIdle System InterfaceMemory Architecture Clock SignalsReset Program MemoryAddress Range Wait State Register Space Full Memory ModeMemory A13 A120 Data MemoryInternal Byte Memory DMA BDMA, Full Memory ModeInternal Memory DMA Port Idma Port Host Memory Mode Memory Space Word Size AlignmentBooting Method Biased Rounding MR Value Biased Unbiased Before RND RND ResultSyntax IOaddr = dreg dreg = IOaddr Designing AN EZ-ICE*-COMPATIBLE SystemTarget Memory Interface Target Board Connector for EZ-ICE* ProbeTarget System Interface Signals PM, DM, BM, IOM, & CMGrade Parameter Min Max Unit Grades Parameter Test Conditions Min Typ Max UnitWR Low Package Total Power Dissipation = Pint + C × VDD2 × fPower Dissipation AssumptionsCapacitive Loading Output Disable TimeOutput Enable Time Test ConditionsParameter Min Max Clock Signals and Reset Control SignalsParameter Min Max Unit Interrupts and Flag IRQx FI, or PFx Setup before Clkout Low1, 2, 3 TCK +Flag Output Delay from Clkout Low5 TCK + Flag Output Hold after Clkout Low5 25 tCKParameter Min Max Unit Bus Request/Grant Parameter Min Max Unit Memory Read Parameter Min Max Unit Memory Write Parameter Min Max Unit Serial Ports Parameter Min Max Unit Idma Address Latch Iack Low before Start of Write1 IAD15-0 Data Setup before End of Write2, 3Parameter Min Max Idma Write, Short Write Cycle Duration of Write1Low before Start of Write1 IAD15-0 Data Setup beforeParameter Min Max Unit Idma Write, Long Write Cycle Low4 TCKParameter Min Max Unit Idma Read, Long Read Cycle High after Start of Read1 Duration of Read Switching CharacteristicsParameter Min Max Unit Idma Read, Short Read Cycle Lead Tqfp Package Pinout ADSP-2186A5/IAD4 PinNumber Name A4/IAD3 A6/IAD5ST-100 Outline DimensionsOrdering Guide Page C2999-6-3/97