7.5.4.2Vibration a. Operating—normal
The drive as installed for normal operation, shall comply with the complete specified performance while subjected to vibration:
Vibration may be applied in the X, Y, or Z axis. |
|
Operating normal translational random flat profile |
|
20 - 2000 Hz (translational random flat profile) | 16.3 GRMS |
Note. This specification does not cover connection issues that may result from testing at this level.
b.
Equipment as installed for normal operation shall not incur physical damage while subjected to periodic vibration:
Vibration occurring at these levels may degrade operational performance during the abnormal vibration period. Specified operational performance will continue when normal operating vibration levels are resumed. This assumes system recovery routines are available.
Operating abnormal translational random flat profile |
|
20 - 2000 Hz (translational random flat profile) | 16.3 GRMS |
Note. This specification does not cover connection issues that may result from testing at this level.
c.
The limits of
The drive shall not incur physical damage or degraded performance as a result of vibration. Vibration may be applied in the X, Y, or Z axis.
| |
20 - 2000 Hz (translational random flat profile) | 16.3 GRMS |
7.5.5Air cleanliness
The drive is designed to operate in a typical office environment with minimal environmental control.
7.5.6Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM B845. However, this accelerated testing cannot duplicate every potential application environment.
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corro- sive chemicals as electronic drive component reliability can be affected by the installation environment. The sil- ver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide, chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or exposed to an ambient relative humidity greater than 95%. Materials used in cabinet fabrication, such as vulca- nized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of any electronic equipment may be extended by replacing materials near circuitry with
7.5.7Electromagnetic susceptibility
See Section 3.1.1.1.
32 | Pulsar XT.2 SAS Product Manual, Rev. B |