Cypress CY7C1382DV25, CY7C1380DV25, CY7C1380FV25, CY7C1382FV25 manual Ordering Information

Page 24

CY7C1380DV25, CY7C1380FV25

CY7C1382DV25, CY7C1382FV25

Ordering Information

Not all of the speed, package, and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered.

Speed

Ordering Code

Package

Part and Package Type

Operating

(MHz)

Diagram

Range

 

 

 

 

 

167

CY7C1380DV25-167AXC

51-85050

100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

Commercial

 

 

 

 

 

 

CY7C1382DV25-167AXC

 

 

 

 

 

 

 

 

 

CY7C1380FV25-167BGC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

CY7C1382FV25-167BGC

 

 

 

 

 

 

 

 

 

CY7C1380FV25-167BGXC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

CY7C1382FV25-167BGXC

 

 

 

 

 

 

 

 

 

CY7C1380DV25-167BZC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

CY7C1382DV25-167BZC

 

 

 

 

 

 

 

 

 

CY7C1380DV25-167BZXC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

CY7C1382DV25-167BZXC

 

 

 

 

 

 

 

 

 

CY7C1380DV25-167AXI

51-85050

100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

Industrial

 

 

 

 

 

 

CY7C1382DV25-167AXI

 

 

 

 

 

 

 

 

 

CY7C1380FV25-167BGI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

CY7C1382FV25-167BGI

 

 

 

 

 

 

 

 

 

CY7C1380FV25-167BGXI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

CY7C1382FV25-167BGXI

 

 

 

 

 

 

 

 

 

CY7C1380DV25-167BZI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

CY7C1382DV25-167BZI

 

 

 

 

 

 

 

 

 

CY7C1380DV25-167BZXI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

CY7C1382DV25-167BZXI

 

 

 

 

 

 

 

 

200

CY7C1380DV25-200AXC

51-85050

100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

Commercial

 

 

 

 

 

 

CY7C1382DV25-200AXC

 

 

 

 

 

 

 

 

 

CY7C1380FV25-200BGC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

CY7C1382FV25-200BGC

 

 

 

 

 

 

 

 

 

CY7C1380FV25-200BGXC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

CY7C1382FV25-200BGXC

 

 

 

 

 

 

 

 

 

CY7C1380DV25-200BZC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

CY7C1382DV25-200BZC

 

 

 

 

 

 

 

 

 

CY7C1380DV25-200BZXC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

CY7C1382DV25-200BZXC

 

 

 

 

 

 

 

 

 

CY7C1380DV25-200AXI

51-85050

100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

Industrial

 

 

 

 

 

 

CY7C1382DV25-200AXI

 

 

 

 

 

 

 

 

 

CY7C1380FV25-200BGI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

CY7C1382FV25-200BGI

 

 

 

 

 

 

 

 

 

CY7C1380FV25-200BGXI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

CY7C1382FV25-200BGXI

 

 

 

 

 

 

 

 

 

CY7C1380DV25-200BZI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

CY7C1382DV25-200BZI

 

 

 

 

 

 

 

 

 

CY7C1380DV25-200BZXI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

CY7C1382DV25-200BZXI

 

 

 

 

 

 

 

 

Document #: 38-05546 Rev. *E

 

 

Page 24 of 29

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Image 24
Contents Features Selection Guide250 MHz 200 MHz 167 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1380DV25/CY7C1380FV25 3 512K x Logic Block Diagram CY7C1382DV25/CY7C1382FV25 3 1M xPin Configurations Pin Tqfp Pinout 3 Chip Enable CY7C1380DV25 512K XCY7C1382DV25 1M x Pin Configurations Ball BGA Pinout CY7C1380FV25 512K xPin Configurations Ball Fbga Pinout 3 Chip Enable CY7C1380DV25 512K xPower supply inputs to the core of the device Pin DefinitionsName Description Byte write select inputs, active LOW. Qualified withPower supply for the IO circuitry Single Read AccessesSingle Write Accesses Initiated by Adsp Functional OverviewInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Burst SequencesOperation Add. Used CE1 CE2 CE3 Adsp Adsc ADV Write CLKTruth Table for Read/Write 6 Function CY7C1380DV25/CY7C1380FV25Function CY7C1382DV25/CY7C1382FV25 TAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag Bypass Register TAP Instruction SetTAP AC Switching Characteristics TAP TimingParameter Description Min Max Unit Clock Hold TimesTAP DC Electrical Characteristics And Operating Conditions 5V TAP AC Test Conditions5V TAP AC Output Load Equivalent Identification Register DefinitionsIdentification Codes Ball BGA Boundary Scan Order 13Instruction Code Description Bit # Ball IDA11 Electrical Characteristics Maximum RatingsOperating Range Capacitance Thermal ResistanceAC Test Loads and Waveforms PackageSwitching Characteristics Setup Times250 MHz 200 MHz 167 MHz Parameter Description Min Output TimesSwitching Waveforms Read Cycle TimingWrite Cycle Timing 25 Read/Write Cycle Timing 25, 27 CLZZZ Mode Timing 29 DON’T CareOrdering Information CY7C1382DV25-250BZXI Document # 38-05546 Rev. *E Package Diagrams Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Orig. Description of Change Date Document HistoryDocument Number

CY7C1382DV25, CY7C1380DV25, CY7C1382FV25, CY7C1380FV25 specifications

The Cypress CY7C1380FV25, CY7C1382FV25, CY7C1380DV25, and CY7C1382DV25 are high-performance static random access memory (SRAM) devices distinguished by their reliability and efficiency. These components are designed for applications requiring fast data storage and retrieval, making them ideal for embedded systems, communication devices, and various consumer electronics.

One of the main features of these SRAMs is their access time. The CY7C1380FV25 and CY7C1382FV25 models come with a super-fast access time of 25 nanoseconds, ensuring that data can be retrieved with minimal delay. This characteristic is crucial for high-speed applications, such as networking equipment and automotive systems, where rapid data processing is essential.

Both families of devices offer a competitive data width configuration, with CY7C1380 series providing 8 bits and CY7C1382 series providing 16 bits. This flexibility allows designers to choose the appropriate configuration based on their specific application requirements. Additionally, they support a wide voltage range for ease of integration into various systems.

The CY7C1380FV25 and CY7C1380DV25 devices feature low power consumption, which is vital for battery-operated devices. With their advanced CMOS technology, they exhibit reduced static power requirements, helping to prolong battery life and improve overall system efficiency. The IDD (supply current) ratings are particularly low, making them suitable for energy-sensitive applications.

A notable characteristic of the Cypress memory devices is their asynchronous read and write operations, providing simple interfacing in a variety of designs. They are designed to operate under a wide range of temperature conditions; thus, they are well-suited for industrial applications where temperature fluctuations might be a concern.

Furthermore, the CY7C1382FV25 and CY7C1382DV25 models include features like burst mode capability, enabling faster sequential access, which is beneficial for high-speed data processing tasks. This allows these SRAMs to deliver enhanced performance critical in applications like video processing and real-time data acquisition.

In summary, the Cypress CY7C1380FV25, CY7C1382FV25, CY7C1380DV25, and CY7C1382DV25 are distinguished by their fast access times, low power consumption, and flexible data widths. Their advanced technologies and characteristics make them a reliable choice for a diverse range of high-performance applications, ensuring that engineers can effectively address their design challenges while meeting the demands of modern electronics.