Cypress CY7C1440AV33, CY7C1446AV33 Capacitance19, Thermal Resistance, AC Test Loads and Waveforms

CY7C1440AV33

CY7C1442AV33

CY7C1446AV33

Capacitance[19]

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max.	Max.	Max.
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	6.5	7	5	pF
		VDD = 3.3V
CCLK	Clock Input Capacitance		3	7	5	pF
		VDDQ = 2.5V
CI/O	Input/Output Capacitance		5.5	6	7	pF
Thermal Resistance[19]

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	25.21	20.8	25.31	°C/W
	(Junction to Ambient)	test methods and procedures
		for measuring thermal
ΘJC	Thermal Resistance		2.28	3.2	4.48	°C/W
		impedance, per EIA/JESD51.
	(Junction to Case)

AC Test Loads and Waveforms

3.3V I/O Test Load									R = 317Ω
OUTPUT						3.3V
	Z0	= 50Ω				OUTPUT
				RL	= 50Ω
							5 pF			R = 351Ω
						INCLUDING
			VT = 1.5V			JIG AND
						SCOPE
			(a)					(b)
2.5V I/O Test Load									R = 1667Ω
OUTPUT						2.5V
	Z0	= 50Ω				OUTPUT
				RL	= 50Ω
							5 pF			R = 1538Ω
						INCLUDING
			VT = 1.25V
						JIG AND
			(a)			SCOPE		(b)

Note:

19. Tested initially and after any design or process change that may affect these parameters.

ALL INPUT PULSES

VDDQ		90%
10%
GND
≤ 1ns
		(c)
VDDQ	ALL INPUT PULSES
		90%
10%
GND
≤ 1ns

(c)

90%

10%

≤ 1ns

90%

10%

≤ 1ns

Document #: 38-05383 Rev. *E Page 19 of 31

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