Cypress CY7C1442AV33 Switching Characteristics Over the Operating Range 24, Min Max, Set-up Times

Page 20

CY7C1440AV33

CY7C1442AV33

CY7C1446AV33

Switching Characteristics Over the Operating Range [24, 25]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

–250

–200

–167

 

Parameter

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Description

 

 

 

 

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min.

Max

Min.

Max.

Min.

Max

 

 

 

 

 

 

 

 

 

 

tPOWER

 

VDD(Typical) to the first Access[20]

1

 

1

 

1

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

5

 

6

 

ns

tCH

 

Clock HIGH

1.5

 

2.0

 

2.4

 

ns

tCL

 

Clock LOW

1.5

 

2.0

 

2.4

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid After CLK Rise

 

2.6

 

3.2

 

3.4

ns

tDOH

 

Data Output Hold After CLK Rise

1.0

 

1.5

 

1.5

 

ns

t

 

Clock to Low-Z[21, 22, 23]

1.0

 

1.3

 

1.5

 

ns

CLZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t

 

Clock to High-Z[21, 22, 23]

 

2.6

 

3.0

 

3.4

ns

CHZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tOEV

 

 

 

LOW to Output Valid

 

2.6

 

3.0

 

3.4

ns

OE

tOELZ

 

 

 

LOW to Output Low-Z[21, 22, 23]

0

 

0

 

0

 

ns

OE

tOEHZ

 

 

 

HIGH to Output High-Z[21, 22, 23]

 

2.6

 

3.0

 

3.4

ns

OE

Set-up Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

tADS

 

 

 

 

 

 

 

 

 

 

 

 

 

Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

ADSC,

ADSP

tADVS

 

 

 

 

 

Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

ADV

tWES

 

 

 

 

 

 

 

 

 

 

 

 

 

X Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

GW,

BWE,

BW

tDS

 

Data Input Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

tCES

 

Chip Enable Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

tADH

 

 

 

 

 

 

 

 

 

 

 

Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

ADSP,

ADSC

tADVH

 

 

 

 

Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

ADV

tWEH

 

 

 

 

 

 

 

 

 

 

 

 

 

X Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

GW,

BWE,

BW

tDH

 

Data Input Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

tCEH

 

Chip Enable Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

Notes:

20.This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a read or write operation can be initiated.

21.tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.

22.At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions.

23.This parameter is sampled and not 100% tested.

24.Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V.

25.Test conditions shown in (a) of AC Test Loads unless otherwise noted.

Document #: 38-05383 Rev. *E

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Contents Features Functional Description1Selection Guide 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1440AV33 1M x Logic Block Diagram CY7C1442AV33 2M xCY7C1440AV33 Pin Configurations Pin Tqfp Pinout CY7C1442AV33 2M xCY7C1442AV33 2M x Byte Write Select Inputs, active LOW. Qualified with Pin DefinitionsName Description Power supply inputs to the core of the device Power supply for the I/O circuitryGround for the core of the device Ground for the I/O circuitryFunctional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Truth Table for Read/Write4,8,9 Truth Table for Read/Write4, 8Write Cycle, Suspend Burst Function CY7C1440AV33Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Controller Block Diagram TAP Instruction Set Performing a TAP ResetTAP Registers TAP Timing BypassTAP AC Switching Characteristics Over the operating Range10 3V TAP AC Test Conditions5V TAP AC Test Conditions 5V TAP AC Output Load EquivalentTAP DC Electrical Characteristics And Operating Conditions Identification Register DefinitionsScan Register Sizes Identification CodesBall Fbga Boundary Scan Order 14,15 SAMPLE/PRELOADBypass CY7C1440AV33 1M x 36, CY7C1442AV33 2M x Bit # Ball ID Ball Fbga Boundary Scan Order 14 CY7C1446AV33 512K x Bit # Ball IDElectrical Characteristics Over the Operating Range17 Maximum RatingsOperating Range Ambient RangeAC Test Loads and Waveforms Capacitance19Thermal Resistance Switching Characteristics Over the Operating Range 24 250 200 167 Parameter Description Unit MinMin Max Set-up TimesSwitching Waveforms Read Cycle Timing26Write Cycle Timing26 Read/Write Cycle Timing26, 28 CLZZZ Mode Timing30 DON’T CareOrdering Information 250 Package Diagrams Pin Tqfp 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document Number Issue Date Orig. Description of ChangeDocument History AC Switching Characteristics table Updated the Ordering Information table473650 VKN