Cypress CY7C1992CV18, CY7C1393CV18, CY7C1394CV18 manual Parameter Min Max Output Times, DLL Timing

Page 24

CY7C1392CV18, CY7C1992CV18

CY7C1393CV18, CY7C1394CV18

Switching Characteristics (continued)

Over the Operating Range [20, 21]

Cypress

Consortium

 

 

 

 

 

Description

300 MHz

278 MHz

250 MHz

200 MHz

167 MHz

Unit

Parameter

Parameter

 

 

 

 

 

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

tCHQV

C/C

Clock Rise (or K/K in single

0.45

0.45

0.45

0.45

0.50

ns

 

 

 

 

clock mode) to Data Valid

 

 

 

 

 

 

 

 

 

 

 

tDOH

tCHQX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

–0.45

–0.45

–0.45

–0.45

–0.50

ns

Data Output Hold after Output C/C

 

 

 

 

 

Clock Rise (Active to Active)

 

 

 

 

 

 

 

 

 

 

 

tCCQO

tCHCQV

 

 

Clock Rise to Echo Clock Valid

0.45

0.45

0.45

0.45

0.50

ns

C/C

tCQOH

tCHCQX

 

 

 

 

 

 

 

 

 

 

 

 

Clock

–0.45

–0.45

–0.45

–0.45

–0.50

ns

Echo Clock Hold after C/C

 

 

 

 

Rise

 

 

 

 

 

 

 

 

 

 

 

tCQD

tCQHQV

Echo Clock High to Data Valid

 

0.27

 

0.27

 

0.30

 

0.35

 

0.40

ns

tCQDOH

tCQHQX

Echo Clock High to Data Invalid

–0.27

–0.27

–0.30

–0.35

–0.40

ns

tCQH

tCQHCQL

 

 

 

 

 

 

 

 

 

HIGH [24]

1.24

1.35

1.55

1.95

2.45

ns

Output Clock (CQ/CQ)

tCQHCQH

 

tCQHCQH

 

CQ Clock Rise to

 

 

Clock Rise

1.24

1.35

1.55

1.95

2.45

ns

 

 

CQ

 

 

 

 

(rising edge to rising edge) [24]

 

 

 

 

 

 

 

 

 

 

 

tCHZ

tCHQZ

 

 

 

 

 

Rise to High-Z

0.45

0.45

0.45

0.45

0.50

ns

Clock (C/C)

 

 

 

 

(Active to High-Z) [25, 26]

 

 

 

 

 

 

 

 

 

 

 

tCLZ

tCHQX1

 

 

 

 

 

Rise to Low-Z [25, 26]

–0.45

–0.45

–0.45

–0.45

–0.50

ns

Clock (C/C)

DLL Timing

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tKC Var

tKC Var

Clock Phase Jitter

0.20

0.20

0.20

0.20

0.20

ns

tKC lock

tKC lock

DLL Lock Time (K, C)

1024

1024

1024

1024

1024

Cycles

tKC Reset

tKC Reset

K Static to DLL Reset

30

 

30

 

30

 

30

 

30

 

ns

Notes

24.These parameters are extrapolated from the input timing parameters (tKHKH - 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (tKC Var) is already included in the tKHKH). These parameters are only guaranteed by design and are not tested in production

25.tCHZ, tCLZ, are specified with a load capacitance of 5 pF as in (b) of AC Test Loads and Waveforms. Transition is measured ± 100 mV from steady-state voltage.

26.At any voltage and temperature tCHZ is less than tCLZ and tCHZ less than tCO.

Document #: 001-07162 Rev. *C

Page 24 of 30

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Contents Features ConfigurationsFunctional Description Selection GuideLogic Block Diagram CY7C1392CV18 CLKDoff Logic Block Diagram CY7C1393CV18 Logic Block Diagram CY7C1394CV18512K Array Gen Read Data Reg ControlPin Configuration Ball Fbga 13 x 15 x 1.4 mm PinoutCY7C1392CV18 2M x CY7C1992CV18 2M xCY7C1393CV18 1M x CY7C1394CV18 512K xPin Definitions Pin Name Pin DescriptionSynchronous Read/Write input. When Power supply inputs to the core of the device Power supply inputs for the outputs of the deviceIs referenced with respect to TDO for JtagFunctional Overview Application Example Shows four DDR-II SIO used in an applicationTruth Table Write Cycle DescriptionsOperation CommentsWrite cycle description table for CY7C1992CV18 follows Write cycle description table for CY7C1394CV18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram State diagram for the TAP controller followsTAP Controller Block Diagram TAP Electrical CharacteristicsTAP AC Switching Characteristics TAP Timing and Test ConditionsIdentification Register Definitions Scan Register SizesInstruction Codes Register Name Bit SizeBoundary Scan Order Bit # Bump IDPower Up Sequence in DDR-II Sram Power Up SequenceDLL Constraints Electrical Characteristics DC Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Input High Voltage Vref +Input LOW Voltage Vref Document # 001-07162 Rev. *C Capacitance Thermal ResistanceParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga UnitSwitching Characteristics Parameter Min MaxHigh LOWParameter Min Max Output Times DLL TimingSwitching Waveforms BurstOrdering Information 250 167 Package Diagram Ball Fbga 13 x 15 x 1.4 mmSales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC SolutionsDocument History