Cypress CY7C1545V18 manual Features, Configurations, Functional Description, Selection Guide

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CY7C1541V18, CY7C1556V18

CY7C1543V18, CY7C1545V18

72-Mbit QDR™-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)

Features

Separate independent read and write data ports

Supports concurrent transactions

375 MHz clock for high bandwidth

4-word burst for reducing address bus frequency

Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 750 MHz) at 375 MHz

Available in 2.0 clock cycle latency

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Data valid pin (QVLD) to indicate valid data on the output

Single multiplexed address input bus latches address inputs for both read and write ports

Separate port selects for depth expansion

Synchronous internally self-timed writes

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD [1]

HSTL inputs and variable drive HSTL output buffers

Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Configurations

With Read Cycle Latency of 2.0 cycles:

CY7C1541V18 – 8M x 8

CY7C1556V18 – 8M x 9

CY7C1543V18 – 4M x 18

CY7C1545V18 – 2M x 36

Functional Description

The CY7C1541V18, CY7C1556V18, CY7C1543V18, and CY7C1545V18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR-II+ architecture. Similar to QDR-II archi- tecture, QDR-II+ SRAMs consists of two separate ports: the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR-II+ architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus that exists with common IO devices. Each port is accessed through a common address bus. Addresses for read and write addresses are latched on alternate rising edges of the input (K) clock. Accesses to the QDR-II+ read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is associated with four 8-bit words (CY7C1541V18), 9-bit words (CY7C1556V18), 18-bit words (CY7C1543V18), or 36-bit words (CY7C1545V18) that burst sequentially into or out of the device. Because data is trans- ferred into and out of the device on every rising edge of both input clocks (K and K), memory bandwidth is maximized while simpli- fying system design by eliminating bus “turn-arounds”.

Depth expansion is accomplished with port selects, which enables each port to operate independently.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Selection Guide

Description

 

375 MHz

333 MHz

300 MHz

Unit

Maximum Operating Frequency

 

375

333

300

MHz

 

 

 

 

 

 

Maximum Operating Current

x8

1300

1200

1100

mA

 

 

 

 

 

 

 

x9

1300

1200

1100

 

 

 

 

 

 

 

 

x18

1300

1200

1100

 

 

 

 

 

 

 

 

x36

1370

1230

1140

 

 

 

 

 

 

 

Note

1.The QDR consortium specification for VDDQ is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting VDDQ = 1.4V to VDD.

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document Number: 001-05389 Rev. *F

 

Revised March 06, 2008

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1556V18 Logic Block Diagram CY7C1541V18Doff Logic Block Diagram CY7C1545V18 Logic Block Diagram CY7C1543V18Ball Fbga 15 x 17 x 1.4 mm Pinout Pin ConfigurationCY7C1541V18 8M x CY7C1556V18 8M xWPS BWS CY7C1543V18 4M xCY7C1545V18 4M x Pin Name Pin Description Pin DefinitionsNegative Input Clock Input Power Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagRead Operations Functional OverviewWrite Operations Byte Write OperationsApplication Example Valid Data Indicator QvldDepth Expansion Programmable ImpedanceWrite Cycle Descriptions Truth TableOperation CommentsWrite cycle description table for CY7C1545V18 follows Write cycle description table for CY7C1556V18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Sample Z State diagram for the TAP controller follows.12 TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsRegister Name Bit Size Instruction Code DescriptionBit # Bump ID Power Up Sequence Power Up Sequence in QDR-II+ SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Operating RangeCapacitance AC Electrical CharacteristicsParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga Unit Thermal ResistanceThermal Resistance Junction to Case Consortium Description 375 MHz 333 MHz 300 MHz Unit Switching CharacteristicsParameter Min Max HighRead/Write/Deselect Sequence 31, 32 Switching WaveformsOrdering Information 300 Ball Fbga 15 x 17 x 1.4 mm Package DiagramIGS VEENXR VKN/FSU