Cypress CY7C1556V18 manual Thermal Resistance, Parameter Description Test Conditions Fbga Unit

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CY7C1541V18, CY7C1556V18

CY7C1543V18, CY7C1545V18

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

 

Test Conditions

165 FBGA

Unit

 

Package

 

 

 

 

 

ΘJA

Thermal Resistance

 

Test conditions follow standard test methods and

11.82

°C/W

 

(Junction to Ambient)

 

procedures for measuring thermal impedance, in

 

 

 

 

 

accordance with EIA/JESD51.

 

 

ΘJC

Thermal Resistance

 

2.33

°C/W

 

 

 

(Junction to Case)

 

 

 

 

 

 

 

 

 

 

 

 

Figure 4. AC Test Loads and Waveforms

 

 

VREF = 0.75V

VREF

 

 

 

 

 

 

 

0.75V

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

Z0 = 50Ω

 

 

 

 

 

 

 

 

 

 

 

 

Device

 

 

 

 

 

 

 

 

 

Under

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Test

 

 

 

 

 

 

 

 

 

 

 

 

 

ZQ

RQ =

250Ω

(a)

RL = 50Ω

VREF = 0.75V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VREF

 

 

 

 

 

 

0.75V

 

 

 

 

 

R = 50Ω

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ALL INPUT PULSES[23]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.25V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Device

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5 pF 0.25V

 

 

 

0.75V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Under

ZQ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Slew Rate = 2 V/ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Test

 

 

 

 

 

 

RQ =

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

250Ω

 

 

 

 

 

 

 

 

 

 

INCLUDING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JIG AND

 

 

 

 

 

 

(b)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCOPE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note

23.Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.

Document Number: 001-05389 Rev. *F

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Contents Functional Description FeaturesConfigurations Selection GuideLogic Block Diagram CY7C1556V18 Logic Block Diagram CY7C1541V18Doff Logic Block Diagram CY7C1543V18 Logic Block Diagram CY7C1545V18CY7C1541V18 8M x Pin ConfigurationBall Fbga 15 x 17 x 1.4 mm Pinout CY7C1556V18 8M xWPS BWS CY7C1543V18 4M xCY7C1545V18 4M x Pin Name Pin Description Pin DefinitionsNegative Input Clock Input TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device TCK Pin for JtagWrite Operations Functional OverviewRead Operations Byte Write OperationsDepth Expansion Valid Data Indicator QvldApplication Example Programmable ImpedanceOperation Truth TableWrite Cycle Descriptions CommentsDevice Write cycle description table for CY7C1556V18 followsWrite cycle description table for CY7C1545V18 follows Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Sample Z TAP Controller State Diagram State diagram for the TAP controller follows.12TAP Controller Block Diagram TAP Electrical CharacteristicsTAP AC Switching Characteristics TAP Timing and Test ConditionsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction Code DescriptionBit # Bump ID Power Up Sequence Power Up Sequence in QDR-II+ SramDLL Constraints Maximum Ratings Electrical CharacteristicsDC Electrical Characteristics Operating RangeCapacitance AC Electrical CharacteristicsParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga Unit Thermal ResistanceThermal Resistance Junction to Case Parameter Min Max Switching CharacteristicsConsortium Description 375 MHz 333 MHz 300 MHz Unit HighSwitching Waveforms Read/Write/Deselect Sequence 31, 32Ordering Information 300 Package Diagram Ball Fbga 15 x 17 x 1.4 mmNXR VEEIGS VKN/FSU
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