Cypress CY7C1418AV18 Application Example, Depth Expansion, Programmable Impedance, Echo Clocks

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CY7C1416AV18, CY7C1427AV18 CY7C1418AV18, CY7C1420AV18

Depth Expansion

Depth expansion requires replicating the LD control signal for each bank. All other control signals can be common between banks as appropriate.

Programmable Impedance

An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5x the value of the intended line impedance driven by the SRAM, The allowable range of RQ to guarantee impedance matching with a tolerance of ± 15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The output impedance is adjusted every 1024 cycles upon power up to account for drifts in supply voltage and temperature.

Echo Clocks

Echo clocks are provided on the DDR-II to simplify data capture on high-speed systems. Two echo clocks are generated by the

DDR-II. CQ is referenced with respect to C and CQ is referenced with respect to C. These are free-running clocks and are synchronized to the output clock of the DDR-II. In the single clock mode, CQ is generated with respect to K, and CQ is generated with respect to K. The timings for the echo clocks is shown in the AC Timing Table.

DLL

These chips use a Delay Lock Loop (DLL) that is designed to function between 120 MHz and the specified maximum clock frequency. During power up, when the DOFF is tied HIGH, the DLL is locked after 1024 cycles of stable clock. The DLL can also be reset by slowing or stopping the input clock K and K for a minimum of 30 ns. However, it is not necessary to reset the DLL to lock to the desired frequency. The DLL automatically locks 1024 clock cycles after a stable clock is presented. The DLL may be disabled by applying ground to the DOFF pin. For information refer to the application note AN5062, DLL Considerations in QDRII/DDRII/QDRII+/DDRII+.

Application Example

Figure 1 shows two DDR-II used in an application.

Figure 1. Application Example

SRAM#1 ZQ

DQCQ/CQ#

A LD# R/W# C C# K K#

 

DQ

 

BUS

Addresses

 

MASTER

Cycle Start#

 

(CPU

R/W#

 

or

Return CLK

Vterm = 0.75V

ASIC)

Source CLK

R = 50ohms

 

Return CLK#

 

Vterm = 0.75V

 

Source CLK#

 

 

Echo Clock1/Echo Clock#1

 

Echo Clock2/Echo Clock#2

 

R = 250ohms

SRAM#2

 

ZQ

 

 

 

 

 

DQ

CQ/CQ#

 

 

 

 

A LD# R/W# C C#

K K#

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

R = 250ohms

Document Number: 38-05616 Rev. *F

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1427AV18 Logic Block Diagram CY7C1416AV18Doff CLKLogic Block Diagram CY7C1418AV18 Logic Block Diagram CY7C1420AV18BWS Ball Fbga 15 x 17 x 1.4 mm Pinout Pin ConfigurationCY7C1416AV18 4M x CY7C1427AV18 4M xCY7C1420AV18 1M x CY7C1418AV18 2M xPin Definitions Pin Name Pin DescriptionSynchronous Read or Write Input. When Power Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceReferenced with Respect to TDO for JtagFunctional Overview Depth Expansion Application ExampleProgrammable Impedance Echo ClocksWrite Cycle Descriptions BWS0 BWS1NWS0 NWS1 BWS0 BWS1 BWS2 BWS3 BWS0Ieee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram TAP Electrical Characteristics TAP Controller Block DiagramTDI TCKTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence in DDR-II Sram Power Up SequenceDLL Constraints Electrical Characteristics DC Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Thermal Resistance CapacitanceParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga UnitSwitching Characteristics Clock Rise or K/K in single Clock mode to Data Valid NOP Switching WaveformsRead NOP Write ReadOrdering Information 250 167 Ball Fbga 15 x 17 x 1.4 mm Package DiagramDocument History ECNOirg. Submission Date Description Of Change Worldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal InformationVKN/AESA Pyrs