Cypress CY7C1427AV18, CY7C1416AV18, CY7C1418AV18 Power Up Sequence in DDR-II Sram, DLL Constraints

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CY7C1416AV18, CY7C1427AV18 CY7C1418AV18, CY7C1420AV18

Power Up Sequence in DDR-II SRAM

DDR-II SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations.

Power Up Sequence

Apply power and drive DOFF either HIGH or LOW (All other inputs can be HIGH or LOW).

Apply VDD before VDDQ.

Apply VDDQ before VREF or at the same time as VREF.

Drive DOFF HIGH.

DLL Constraints

DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as tKC Var.

The DLL functions at frequencies down to 120 MHz.

If the input clock is unstable and the DLL is enabled, then the DLL may lock onto an incorrect frequency, causing unstable SRAM behavior. To avoid this, provide1024 cycles stable clock to relock to the desired clock frequency.

Provide stable DOFF (HIGH), power and clock (K, K) for 1024 cycles to lock the DLL.

Figure 3. Power Up Waveforms

~ ~

K

K

 

~ ~

 

Unstable Clock

> 1024 Stable clock

Start Normal

 

 

Operation

Clock Start (Clock Starts after VDD/ V DDQ Stable)

VDD/ VDDQ VDD/ V DDQ Stable (< +/- 0.1V DC per 50ns )

Fix High (or tie to VDDQ)

DOFF

Document Number: 38-05616 Rev. *F

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Contents Selection Guide FeaturesConfigurations Functional DescriptionCLK Logic Block Diagram CY7C1416AV18Logic Block Diagram CY7C1427AV18 DoffLogic Block Diagram CY7C1420AV18 Logic Block Diagram CY7C1418AV18BWS CY7C1427AV18 4M x Pin ConfigurationBall Fbga 15 x 17 x 1.4 mm Pinout CY7C1416AV18 4M xCY7C1420AV18 1M x CY7C1418AV18 2M xPin Name Pin Description Pin DefinitionsSynchronous Read or Write Input. When TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device Referenced with Respect toFunctional Overview Echo Clocks Application ExampleDepth Expansion Programmable ImpedanceBWS0 BWS1 Write Cycle DescriptionsNWS0 NWS1 BWS0 BWS1 BWS2 BWS3 BWS0Ieee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram TCK TAP Controller Block DiagramTAP Electrical Characteristics TDITAP Timing and Test Conditions TAP AC Switching CharacteristicsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction CodesBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Parameter Description Test Conditions Fbga Unit CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitSwitching Characteristics Clock Rise or K/K in single Clock mode to Data Valid NOP Write Read Switching WaveformsNOP ReadOrdering Information 250 167 Ball Fbga 15 x 17 x 1.4 mm Package DiagramECN Document HistoryOirg. Submission Date Description Of Change Pyrs Sales, Solutions, and Legal InformationWorldwide Sales and Design Support Products PSoC Solutions VKN/AESA