Intel 820E 6.3. Thermal Design Power , 6.4. Glue Chip 3 (Intel 820E Chipset Glue Chip)

Intel® 820E Chipset
R
Design Guide 193
6.3. Thermal Design Power
The thermal design power is the estimated maximum possible expected power generated in a component
by a realistic application. It is based on extrapolations of both hardware and software technology over the
life of the product. It does not represent the expected power generated by a power virus. For thermal
design considerations regarding the Pentium III processor using the Intel PGA370 socket, refer to the
Intel® 820 Chipset Design Guide Addendum for the Intel® Pentium® III Processor for the PGA370
Socket. These guidelines can be downloaded from the Intel website at:
http://developer.intel.com/design/chipsets/designex/298178.htm
The thermal design power numbers for the MCH and the ICH2 are listed in the following table.
Table 63. Intel® 820E Chipset Component Thermal Design Power
Component Thermal Design Power (133/400 MHz)
MCH 3.5 W ± 15%
ICH2 1.5 W ± 15%
6.4. Glue Chip 3 (Intel® 820E Chipset Glue Chip)
To reduce the component count and BOM cost of the Intel 820E chipset platform, Intel has developed an
ASIC component that integrates miscellaneous platform logic into a single chip. Glue Chip 3 is designed
to integrate some or all of the following functions into a single device. By integrating much of the
required glue logic into a single device, the overall board cost can be reduced.
Features
• PWROK signal generation
• Control circuitry for Suspend to RAM
• Power supply power-up circuitry
• RSMRST# generation
• Back-feed cutoff circuit for Suspend to RAM
• 5 V reference generation
• Flash FLUSH# / INIT# circuit
• HD single-color LED driver
• IDE reset signal generation/PCIRST# buffers
• Voltage translation for audio MIDI signal
• Audio disable circuit
• Voltage translation for DDC to monitor
• Tri-state buffers for test