Intel manual Thermal Design Power, Glue Chip 3 Intel 820E Chipset Glue Chip, Features

Intel® 820E Chipset

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6.3.Thermal Design Power

The thermal design power is the estimated maximum possible expected power generated in a component by a realistic application. It is based on extrapolations of both hardware and software technology over the life of the product. It does not represent the expected power generated by a power virus. For thermal design considerations regarding the Pentium III processor using the Intel PGA370 socket, refer to the Intel® 820 Chipset Design Guide Addendum for the Intel® Pentium® III Processor for the PGA370 Socket. These guidelines can be downloaded from the Intel website at: http://developer.intel.com/design/chipsets/designex/298178.htm

The thermal design power numbers for the MCH and the ICH2 are listed in the following table.

Table 63. Intel® 820E Chipset Component Thermal Design Power

Component	Thermal Design Power (133/400 MHz)
MCH	3.5 W ± 15%
ICH2	1.5 W ± 15%

6.4.Glue Chip 3 (Intel® 820E Chipset Glue Chip)

To reduce the component count and BOM cost of the Intel 820E chipset platform, Intel has developed an ASIC component that integrates miscellaneous platform logic into a single chip. Glue Chip 3 is designed to integrate some or all of the following functions into a single device. By integrating much of the required glue logic into a single device, the overall board cost can be reduced.

Features

•PWROK signal generation

•Control circuitry for Suspend to RAM

•Power supply power-up circuitry

•RSMRST# generation

•Back-feed cutoff circuit for Suspend to RAM

•5 V reference generation

•Flash FLUSH# / INIT# circuit

•HD single-color LED driver

•IDE reset signal generation/PCIRST# buffers

•Voltage translation for audio MIDI signal

•Audio disable circuit

•Voltage translation for DDC to monitor

•Tri-state buffers for test

Design Guide 193