Use a GPO to Reduce Drcg Frequency | Intel 820E instruction

Intel® 820E Chipset

R

Figure 105. Use a GPO to Reduce DRCG Frequency

GPO

S0

DRCG

S0

gpo_drcg-freq

6.1.5.2.Option 2: Increase the Current Capability of the 2.5 V Voltage Regulator

The second implementation option requires that the 2.5 V power supply be modified to maintain the maximum amount of current required by a fully populated RDRAM channel (~7.5 A).

Design Guide

191

Image 191

Intel 820E manual Use a GPO to Reduce Drcg Frequency

Contents

Design Guide Intel 820E Chipset Intel 820E Chipset Contents 1.1 102 AGTL+ 191 Figures CDCDNENAB# Support Circuitry for Multi-Channel Audio Upgrade Mil Stack-Up Tables 135 Rev Description Date Revision History About This Design Guide Introduction Reference Documents System Overview Controller Hub 2 ICH2 Chipset ComponentsMemory Controller Hub MCH Intel 820E Chipset Platform Bandwidth Summary FWH Flash BiosBandwidth Summary ISA Bridge MCH System Configuration UltraATA/100/66/33 USB Ports 2 HC AC97 Codecs AGP Platform InitiativesDirect Rambus RAM Rdram Streaming Simd Extensions Manageability Integrated LAN ControllerUltra ATA/100 Support Expanded USB Support Interrupt Controller Function DisableIntruder Detect SMBus 9. AC’97 Ebga C AC’97 Connections Low-Pin-Count LPC Interface This page is intentionally left blank Component Quadrant Layout General Recommendations MCH Sample ATX and NLX MCH/ICH2 Component Placement Intel 820E Chipset Component Placement Primary-Side MCH Core Routing Example ATX Core Chipset Routing Recommendations Secondary-Side MCH Core Routing Example ATX Data Strobing Example Source-Synchronous Strobing Data Associated Strobe Differential Clocking/StrobingDirect RDRAM* Interface AGP 2× Data/Strobe Association Direct RDRAM* Layout Guidelines Stack-Up Reference Trace Description Maximum Trace Length Placement Guidelines for Motherboard Routing LengthsRSL Routing RSL Routing Diagram Secondary-Side RSL Breakout Example Direct Rdram Termination RSL Termination Direct RDRAM* Termination Example Direct RDRAM* Ground Plane Reference GND Plane Plane Equation 1. Approximate Copper Tab Area Calculation Direct RDRAM* Connector Compensation Copper Tab Area Calculation Connector Compensation Example Section a See Note, Top Layer Section a See Note, Bottom Layer Section B See Note, Top Layer Section B See Note, Bottom Layer RSL and Clocking Signal Routing Layer Capacitance pF Flood Signal RSL Signal Layer Alternation RSL Routing Layer Requirements Length Matching Methods Equation 3. Rdram Clock Signal Trace Length Calculation Equation 2. Rdram RSL Signal Trace Length Calculation Length Matching and Via Compensation Example Via Compensation Signal Ball on Nominal Package High-Speed Cmos Routing Direct RDRAM* Reference Voltage High-Speed Cmos Termination SIO Routing Rdram Cmos Shunt Transistor Suspend-to-RAM Shunt Transistor Direct RDRAM* Clock Routing Direct RDRAM* Design ChecklistSignal List RSL Signals High-Speed Serial Clocks Intel 820E Chipset Primary side If Signal Routed from MCH AGP AGP Interface Signal Groups Signal Groups AGP 2.0 Data/Strobe Associations 2 × Timing Domain Routing Guidelines3 ×/4× Timing Domain Routing Guidelines Interfaces 6 Inches AGP 2×/4× Routing Example for Interfaces 6 Inches Interfaces 6 Inches and 7.25 Inches AGP 2.0 Routing Summary1,2 Signal Maximum Trace Spacing Length Relative ToAGP 2.0 Routing Summary All AGP Interfaces Decoupling AGP Clock RoutingGeneral AGP Routing Guidelines Recommendations Ground Reference Vddq Generation and TYPEDET# TYPEDET# on Add-in Card DDQ Supplied by MB TYPDET#/VDDQ Relationship AGP Vddq Generation Example Circuit Vref Generation for AGP 2.0 2× and 4× AGP 2.0 Vref Generation and Distribution 16 k Ω CompensationAGP Pull-Ups Motherboard / Add-in Card Interoperability AGP Signal Voltage Tolerance ListConnector / Add-in Card Interoperability Connector Universal Connector AGP Left-Handed Retention Mechanism AGP Universal Retention Mechanism RM AMP P/N AGP Left-Handed RM Keep-Out Information Hub Interface Hub Interface Signal Routing Example Bit Hub Interface Routing Guidelines Bit Hub Interface Data SignalsBit Hub Interface Strobe Signals Bit Hub Interface Buffer Configuration Setting MCH ICH2 Hlrefa Hubref Bit Hub Interface Hubref Generation Circuit Specifications Component Hub Interface Trace Rcomp Resistor Value Bit Hub Interface CompensationBit Hub Interface Decoupling Guidelines Bit Hub Interface Rcomp Resistor Values Minimizing Crosstalk on the AGTL+ Interface Additional Host Bus GuidelinesSystem Bus Ground Plane Reference Cable IDE InterfaceAdditional Considerations Combination Host-Side/Device-Side Cable Detection Cable Detection for Ultra ATA/66 and Ultra ATA/100 Combination Host-Side/Device-Side IDE Cable Detection Device-Side IDE Cable Detection Device-Side Cable Detection Primary IDE Connector Requirements Siordy IRQ15 SDDACK# Secondary IDE Connector RequirementsSDCS1# SDCS3# SDIOR# SDIOW# Sddreq ICH2 AC’97- Codec Connection 13. AC’97 Intel 820E Chipset Motherboard CNR Board CNR CDCDNENAB# Signal DescriptionsAC97RESET# Invalid Codec Configurations Valid Codec ConfigurationsCodec Configurations Valid Codec Configurations 13.3. AC’97 Routing Motherboard Implementation Using Native USB InterfaceUSB Disabling the Native USB Interface of ICH2 Recommended USB trace characteristicsISA Support SMBus/SMLink Interface 16. I/O Apic Design Recommendation SMBus / SMLink Use Implementation Pull-Up Requirements for SMBus and SMLink Signals RTC PCI External Capacitors RTC Crystal RTC Layout Considerations RTC External Battery Connection Rtcrst External Circuit for ICH2 RTC RTC External Rtcrst Circuit RTC-Well Input Strap Requirements Spkr Pin ConsiderationRTC Routing Guidelines Vbias DC Voltage and Noise Measurements Usage of I/O Apic Interrupt Inputs 16 through Function in ICH2 using the PCI IRQ in IoapicICH2 Pirq Routing PIRQE# PIRQF# PIRQG# PIRQH# Inta Intb Intc Intd LAN Connect Component Connection FeaturesLAN Layout Guidelines PIRQA# PIRQB# PIRQC# PIRQD# Layout Section Previous Design Guide Section ICH2 LAN Interconnect GuidelinesLAN Design Guide Section Reference LOM/CNR Interconnect Bus TopologiesPoint-to-Point Interconnect Length Requirements for Figure Signal Routing and LayoutConfiguration Line Termination Crosstalk ConsiderationImpedances General Trace Routing Considerations General LAN Routing Guidelines and Considerations Trace Geometry and Length Power and Ground Connections Ground Plane Separation Layer Board Design Design Guide 111 Related Documents Guidelines for Intel 82562EH Component PlacementIntel 82562EH Home/PNA* Guidelines Crystals and Oscillators Intel 82562EH Component Termination Phoneline Hpna Termination Distance Priority Guideline Critical DimensionsLPF Eeprom Distance from LPF to Phone RJ11 Intel 82562ET / Intel 82562EM Component Guidelines Intel 82562ET/82562EM Component Termination Distance from Magnetics Module to RJ45 Terminating Unused Connections Reducing Circuit Inductance LAN Disable Circuit Intel 82562ET/EM Disable Guidelines Lancl Dual-Footprint Analog Interface Decoupling Capacitor Recommendation Power Plane/Pins # Decoupling Capacitor ValueICH2 Decoupling Recommendations Decoupling Capacitor Layout FWH Flash Bios VPP Design Guidelines FWH Flash Bios GuidelinesIn-Circuit FWH Flash Bios Programming PCI Interface ICH2 Design ChecklistChecklist Items Recommendations Reason/Effect Eeprom Interface FWH Flash Bios InterfaceHub Interface LAN Interface PIRQ#E Interrupt InterfacePIRQ#DA PIRQ#H VCCSUS3.3 GpioUSB Interface Processor Signals AC’97 System ManagementRTC 5VREF SUS Miscellaneous SignalsPower Spkr IDE Checklist ICH2 AD22 / ISA ISA Bridge ChecklistChecklist Items USB ICH2 Layout ChecklistBit Hub Interface IDE Interface LAN Connect I/F ICH2 Decoupling Layout Recommendations Yes CK-SKS Clocking 138 Design Guide Term Definition Terminology and Definitions 140 Design Guide Guideline Methodology AGTL+ Design Guidelines Equation 6. Maximum Flight Time Equation 4. Setup TimeInitial Timing Analysis Equation 5. Hold Time IC Parameters Pentium Intel AGTL+ Parameters for Example Calculations1,2 Driver Receiver Clk Example Tfltmax Calculations for 133 MHz Bus1 Sensitivity Analysis Determine the Desired General Topology, Layout, and RoutingPre-Layout Simulation Methodology Simulation Criteria Monte Carlo Analysis Layout and Route Board Estimate Component-to-Component Spacing for AGTL+ SignalsPlace and Route Board Crosstalk Type Trace WidthSpace Ratio Host Clock Routing Apic Data Bus RoutingTrace Width Space Guidelines Post-Layout Simulation Intersymbol Interference Measurements Flight Time Simulation ValidationCrosstalk Analysis SET Q CLR Q Equation 8. Valid Delay EquationFlight Time Hardware Validation Timing Requirements TheoryAGTL+ Aggressor and Victim Networks Crosstalk Theory Potential Termination Crosstalk Problems Textbook Timing Equations More Details and Insight Effective Impedance and Tolerance/Variation Power Distribution Reference Planes and PCB Stack-Up One Signal Layer and One Reference Plane Layer Switch with Multiple Reference Planes Same Type One Layer with Multiple Reference Planes High-Frequency Decoupling Clock Routing Overdrive Region Vref Guard BandRingback Levels Flight Time Definition and Measurement Conclusion Number Name on CK133 Used for Routed to Frequency Voltage Clock GenerationIntel 820E Chipset Platform System Clocks Intel 820E Chipset Platform Clock Distribution LPCCLK, Pciclk Intel 820E Chipset Platform Clock SkewsRelationship Skew Pin-to-Pin ps Board ps Total ps Min Max ±TBD3 Intel 820E Chipset Clock Routing Guidelines1,2 CK133/DRCG Pin Name Component Intel 820E Chipset Platform System Clock Cross-Reference 2. CK133 to Drcg Component Placement and Interconnection Layout Requirements1 .318 MHz Crystal to CK133 MCH to Drcg MCH-to-DRCG Routing Diagram Clock From Length inches Section DRCG-to-RDRAM ChannelTrace Length Trace Geometry Differential Clock Routing Diagram Sections A, C & D CMID, CMID2 Drcg Impedance Matching CircuitExternal Drcg Component Values1,2 Component Nominal Value Drcg Layout Example AGP Clock Routing GuidelinesClock Routing Guidelines for Intel PGA370 Designs Series Termination Resistors for CK133 Clock Outputs Buffer Name CC Range Impedance If Unused Output Unused OutputsDecoupling Recommendation for CK133 and Drcg Unused Output Termination Drcg Frequency Selection and the DRCG+ Drcg Frequency Selection Table and Jitter Specification DRCG+ Frequency Selection DRCG+ Frequency Selection Schematic PCB Materials Stack-Up Requirement Test Coupon Design Guidelines Design Process Sample SM max Resin % Recommended Stack-UpInner-Layer Routing Stack-Up Examples Field Solver vs. Zcalc Impedance Calculation Tools Board Impedance/Stack-up Summary Testing Board Impedance 182 Design Guide Term Definition Power DeliveryTerminology and Definitions Intel 820E Chipset Power Delivery Example VCC Dual Switch Vbsy 3VSB V and 2.5 V Power Sequencing Schottky Diode VSB ICH2 1.8 V / 3.3 V Power Sequencing 4 .3V/V5REF Sequencing Example 1.8V/3.3V Power Sequencing Circuit Vref Excessive Power Consumption by 64/72-Mbit RdramOption 1 Reduce the Clock Frequency During Initialization Use a GPO to Reduce Drcg Frequency Example of ICH2 Power Plane Split ICH2 Power Plane Split Component Thermal Design Power 133/400 MHz Thermal Design PowerFeatures Intel 820E Chipset Component Thermal Design Power Vendor Intel Contact Contact Information Glue Chip Vendors Reference Design Feature Set Appendix a Reference Design Schematics Uniprocessor 196 Design Guide FOLSOM, California Last Revised Sheet REVDrawn by PCG Platform Design Project PCG AE Prairie City Road Device Table Block Diagram AL9 AK8AH8 AN9 Tckr TDI Tmsr CPURST#R2 DBRESET#VCMOS15 Gtlref Clock Synthesizer Hubref Agpref Ramrefb Ramrefa Gtlrefb Gtlrefa Host Hubref RamrefrRamref Connagpref GAD2 GAD3 GAD0GAD0 GAD1 GAD1 GAD2 AD3 AD0AD1 AD2 Rtcrstjp ACRESET#CR4 Vbatcr 1UF VCC10 VCC31 Vppr VPP GND30 PCIRST# GND29 NC1 GndaFwhic Vcca LFRAME#/FWH4 NC3 NC4 INIT# HINIT# NC5 RFU36 NC6 RFU35 FGPI4 RFU34 NC8 RFU33 Fwhpclk CLK RFU32 Rimm LDQA0 SWP RSRV4/RESETRSRV4/RESET SWP TERMDQA80 Super I/O AC’97 Audio DB15AUDSTK Micinr MicinfbMicin Micinc Communication And Network Riser CNR ACSDATAIN0CNR Acsynccnr Acsdataoutcnr Stubs on AC97 LinkACSDATAIN0ICH2 ACSYNCICH2 ACSDATAOUTICH2 RP7 LAN 82562EH 82562ET/EM LAN RJ11 For 82562EH Lanactled LAN RJ45 For 82562ET/EMH1138ARAGONITE LAN Option Intel PART# 25MHZY5 Xtal Y2 Xtal LANCLKX1 R381LANCLKX2 Stuff for 82562EH VCC12 Irtx Power SWPower LED SW1 Agpclkconn B7 CLK AGP4XU20 AGPOC#TYPEDET# USBAGP+ B4 Usbagp Ptdi VCC5 VCC12PCI3CON PTRST# Ptck Ptms PCI Connectors IDE Connectors USB Connectors Port Parallel Serial Ports Keyboard/Mouse/Floppy VCC5 JOY1XR JOY2XR Midioutr JOY2YR JOY1YR Midiinr Game Port Imax VRM G1 VRM G2 VRM Fault VRM IFBFAULT# IFB Vccvid REV Project Voltage Regulators SBY ITH R 1UF-X7RVCC33SBYTG VCC33SBYSW VCC25SBY VCC5DUAL VCC33SBY VCC33SBYCOSC VCC33SBYRUN VCC33SBYITH Power Connector HREQ#0 BPRI# DBSY# PCI/AGP Pullups/Pulldowns Termcmd Termsck Rambus* Termination Decoupling Bulk Decoupling Drawn by PCG Platform Design Project PCG AE VCMOS18SBY Revision History Drawn by PCG Platform Design Project PCG AE Revision History HL8 HL4 HL5 HL6 HL7 Hub Interface Connector For debug onlyProbe Connector TESTCLK66 HL0 HL1 HL2 HL3 HL9 Hlstb HLSTB#