Decoupling | Intel 820E instruction

8

7

6

5

4

3

2

1

D

C

Decoupling

MCH Decoupling

VCC1_8

	C157		0.1UF
	C157



	C212		0.1UF
			0.1UF


	C201		0.1UF
	C156		0.01UF
	C156		0.01UF
	C213		0.01UF
	C213		0.01UF
	C202		0.01UF
	C202		0.01UF


	C221		0.1UF
	C197		0.1UF
	C197		0.1UF

MCH Decoupling VCC1_8

C361	0.1UF
	0.1UF
C359	0.1UF
	0.1UF
C360	0.1UF
C362	0.1UF

Backside No Stuff

NOTE: Place VDDQ decoupling as close to the MCH as possible

FCPGA VCC_CORE Decoupling

ICH Decoupling

82559 Decoupling

FCPGA Vtt Decoupling

VDDQ

VCC3_3

VCC3_3SBY

VTT1_5

VTT1_5

C166 C162 C368 C367 C343 C344

0.01UF

C252 C230 C224 C254 C248 C232 C231 C253

0.1UF

C290 C88 C105 C60 C29 C30

VCCVID

VCCVID

0.1UF

C454 C453 C452 C451 C448 C449 C450

0.1UF

C464 C463 C462 C461 C460 C459 C458

0.1UF

0.01UF

0.1UF

0.1UF

C134 C139 C131 C136 C137

4.7UF

C133 C138 C132 C141 C135

4.7UF

D

0.1UF

0.1UF

0.1UF

0.01UF

0.1UF

4.7UF

4.7UF

0.1UF

0.1UF

0.1UF

0.01UF

0.1UF

4.7UF

4.7UF

0.1UF

0.1UF

0.01UF

4.7UF

4.7UF

4.7UF

0.1UF

0.1UF

0.01UF

0.01UF

4.7UF

4.7UF

4.7UF

0.1UF

0.1UF

0.01UF

0.01UF

0.01UF

0.1UF

0.1UF

C414

0.01UF

All 4.7uF capacitors should be 1206 package size placed

C455

0.1UF

C465

0.1UF

within the PGA370 socket cavity on componet side of PCB.

C415

0.01UF

C456

0.1UF

C466

0.1UF

C

C457

0.1UF

Backside No Stuff - C414,C415

B

A

For chipset decoupling, use 0.1UF and 0.01UF decoupling capacitor

at each corner of the device. If there is room, also add 0.01UF capacitor in the middle of each quad. Place additional caps if routable.

VCC3_3SBY
U15 14		10
11		10
74LVC14A7			VCC5SBY
			U18
			74LS132	14VCC
			1	14VCC
			2	3
			2
				7 GND
VCC3_3SBY
9	14	U3	U18
9	14	8	U18
10		8	74LS132	14VCC
10			12	14VCC
SN74LVC08A			13	11
SN74LVC08A			13

7 GND

8

7

									VCC3_3SBY		VCC3_3SBY
		VCC3_3SBY			VCC3_3			U23			SN74LVC02A
Un-used Gates		VCC3_3SBY						U23		U24	SN74LVC02A
								SN74HC03		U24
								4	14 VCC		4
								5			4
									6	5	14VCC
					U19				7 GND	6	B
						VCC			7 GND		7 GND
						VCC					7 GND
					3	14	4
					3		4
		U14	VCC		7	GND
		U14	VCC		SN74LVC07A	GND		U23			SN74LVC02A
VCC3_3SBY		9	14	8	SN74LVC07A			U23		U24	SN74LVC02A
VCC3_3SBY		9		8				SN74HC03		U24
								9	14VCC		14VCC
		7	GND					10	8	8	14VCC
		SN74LVC07A	GND		U19			10		9	10
		SN74LVC07A				VCC			7 GND	9
						VCC			7 GND
					11	14	10				7 GND
					11		10
U20	14VCC				7	GND
					SN74LVC07A	GND
					SN74LVC07A
13	12										SN74LVC02A
	7 GND							U23		U24	SN74LVC02A
	7 GND							U23		U24
SN74LVC06A								SN74HC03		11	14VCC
					U19			12	14 VCC	11	14VCC
					U19	VCC			11		13
					13	14	12	13		12
					13		12		7 GND		7 GND
					7				7 GND		7 GND
					7	GND
					SN74LVC07A	GND
U20	14VCC				SN74LVC07A
U20	14VCC
11	10
	7 GND										A
SN74LVC06A

				TITLE: INTEL(R) 820E CHIPSET 2 DIMM FCPGA REFERENCE BOARD					REV:
				DECOUPLING				DRAWN BY:	0.5
						R	PCG PLATFORM DESIGN	DRAWN BY:	PROJECT:
						R	PCG PLATFORM DESIGN	PCG AE	Camino2
							1900 PRAIRIE CITY ROAD	PCG AE	Camino2
							FOLSOM, CALIFORNIA 95630	LAST REVISED:	SHEET:
							FOLSOM, CALIFORNIA 95630	3-20-2000_10:14	40 OF 40
								3-20-2000_10:14	40 OF 40
6	5	4	3				2	1

Image 236

Intel 820E manual Decoupling

Contents

Intel 820E Chipset Design Guide Intel 820E Chipset Contents 1.1 102 AGTL+ 191 Figures CDCDNENAB# Support Circuitry for Multi-Channel Audio Upgrade Tables Mil Stack-Up 135 Revision History Rev Description Date Introduction About This Design Guide Reference Documents System Overview Controller Hub 2 ICH2 Chipset ComponentsMemory Controller Hub MCH FWH Flash Bios Bandwidth SummaryISA Bridge Intel 820E Chipset Platform Bandwidth Summary System Configuration MCH UltraATA/100/66/33 USB Ports 2 HC AC97 Codecs Platform Initiatives Direct Rambus RAM RdramStreaming Simd Extensions AGP Integrated LAN Controller Ultra ATA/100 SupportExpanded USB Support Manageability Function Disable Intruder DetectSMBus Interrupt Controller 9. AC’97 C AC’97 Connections Ebga Low-Pin-Count LPC Interface This page is intentionally left blank General Recommendations Component Quadrant Layout MCH Intel 820E Chipset Component Placement Sample ATX and NLX MCH/ICH2 Component Placement Core Chipset Routing Recommendations Primary-Side MCH Core Routing Example ATX Secondary-Side MCH Core Routing Example ATX Source-Synchronous Strobing Data Strobing Example Differential Clocking/Strobing Direct RDRAM* InterfaceAGP 2× Data/Strobe Association Data Associated Strobe Stack-Up Direct RDRAM* Layout Guidelines Reference Trace Description Maximum Trace Length Placement Guidelines for Motherboard Routing LengthsRSL Routing RSL Routing Diagram Secondary-Side RSL Breakout Example RSL Termination Direct Rdram Termination Direct RDRAM* Ground Plane Reference Direct RDRAM* Termination Example Plane GND Plane Direct RDRAM* Connector Compensation Equation 1. Approximate Copper Tab Area Calculation Copper Tab Area Calculation Connector Compensation Example Section a See Note, Top Layer Section a See Note, Bottom Layer Section B See Note, Top Layer RSL and Clocking Signal Routing Layer Capacitance pF Section B See Note, Bottom Layer Flood Signal RSL Signal Layer Alternation Length Matching Methods RSL Routing Layer Requirements Equation 2. Rdram RSL Signal Trace Length Calculation Equation 3. Rdram Clock Signal Trace Length Calculation Via Compensation Length Matching and Via Compensation Example Signal Ball on Nominal Package Direct RDRAM* Reference Voltage High-Speed Cmos Routing SIO Routing High-Speed Cmos Termination Suspend-to-RAM Shunt Transistor Rdram Cmos Shunt Transistor Direct RDRAM* Design Checklist Signal ListRSL Signals High-Speed Serial Clocks Direct RDRAM* Clock Routing Intel 820E Chipset If Signal Routed from MCH Primary side AGP Interface Signal Groups AGP Signal Groups 2 × Timing Domain Routing Guidelines 3 ×/4× Timing Domain Routing GuidelinesInterfaces 6 Inches AGP 2.0 Data/Strobe Associations Interfaces 6 Inches and 7.25 Inches AGP 2×/4× Routing Example for Interfaces 6 Inches Signal Maximum Trace Spacing Length Relative To AGP 2.0 Routing SummaryAll AGP Interfaces AGP 2.0 Routing Summary1,2 AGP Clock Routing General AGP Routing GuidelinesRecommendations Decoupling Vddq Generation and TYPEDET# Ground Reference TYPDET#/VDDQ Relationship TYPEDET# on Add-in Card DDQ Supplied by MB Vref Generation for AGP 2.0 2× and 4× AGP Vddq Generation Example Circuit AGP 2.0 Vref Generation and Distribution 16 k Ω CompensationAGP Pull-Ups AGP Signal Voltage Tolerance List Connector / Add-in Card InteroperabilityConnector Universal Connector Motherboard / Add-in Card Interoperability AGP Universal Retention Mechanism RM AGP Left-Handed Retention Mechanism AGP Left-Handed RM Keep-Out Information AMP P/N Hub Interface Signal Routing Example Hub Interface Bit Hub Interface Data Signals Bit Hub Interface Strobe SignalsBit Hub Interface Buffer Configuration Setting Bit Hub Interface Routing Guidelines Bit Hub Interface Hubref Generation Circuit Specifications MCH ICH2 Hlrefa Hubref Bit Hub Interface Compensation Bit Hub Interface Decoupling GuidelinesBit Hub Interface Rcomp Resistor Values Component Hub Interface Trace Rcomp Resistor Value Minimizing Crosstalk on the AGTL+ Interface Additional Host Bus GuidelinesSystem Bus Ground Plane Reference Cable IDE InterfaceAdditional Considerations Cable Detection for Ultra ATA/66 and Ultra ATA/100 Combination Host-Side/Device-Side Cable Detection Combination Host-Side/Device-Side IDE Cable Detection Device-Side Cable Detection Device-Side IDE Cable Detection Primary IDE Connector Requirements Siordy IRQ15 SDDACK# Secondary IDE Connector RequirementsSDCS1# SDCS3# SDIOR# SDIOW# Sddreq 13. AC’97 ICH2 AC’97- Codec Connection Intel 820E Chipset Motherboard CNR Board CNR CDCDNENAB# Signal DescriptionsAC97RESET# Valid Codec Configurations Codec ConfigurationsValid Codec Configurations Invalid Codec Configurations 13.3. AC’97 Routing Motherboard Implementation Using Native USB InterfaceUSB Disabling the Native USB Interface of ICH2 Recommended USB trace characteristicsISA Support 16. I/O Apic Design Recommendation SMBus/SMLink Interface Pull-Up Requirements for SMBus and SMLink Signals SMBus / SMLink Use Implementation PCI RTC RTC Crystal External Capacitors RTC External Battery Connection RTC Layout Considerations RTC External Rtcrst Circuit Rtcrst External Circuit for ICH2 RTC Spkr Pin Consideration RTC Routing GuidelinesVbias DC Voltage and Noise Measurements RTC-Well Input Strap Requirements Usage of I/O Apic Interrupt Inputs 16 through Function in ICH2 using the PCI IRQ in IoapicICH2 Pirq Routing LAN Connect Component Connection Features LAN Layout GuidelinesPIRQA# PIRQB# PIRQC# PIRQD# PIRQE# PIRQF# PIRQG# PIRQH# Inta Intb Intc Intd Layout Section Previous Design Guide Section ICH2 LAN Interconnect GuidelinesLAN Design Guide Section Reference LOM/CNR Interconnect Bus TopologiesPoint-to-Point Interconnect Length Requirements for Figure Signal Routing and LayoutConfiguration Line Termination Crosstalk ConsiderationImpedances General LAN Routing Guidelines and Considerations General Trace Routing Considerations Power and Ground Connections Trace Geometry and Length Ground Plane Separation Layer Board Design Design Guide 111 Guidelines for Intel 82562EH Component Placement Intel 82562EH Home/PNA* GuidelinesCrystals and Oscillators Related Documents Phoneline Hpna Termination Intel 82562EH Component Termination Critical Dimensions LPFEeprom Distance Priority Guideline Intel 82562ET / Intel 82562EM Component Guidelines Distance from LPF to Phone RJ11 Intel 82562ET/82562EM Component Termination Distance from Magnetics Module to RJ45 Reducing Circuit Inductance Terminating Unused Connections Intel 82562ET/EM Disable Guidelines LAN Disable Circuit Lancl Dual-Footprint Analog Interface Decoupling Capacitor Recommendation Power Plane/Pins # Decoupling Capacitor ValueICH2 Decoupling Recommendations Decoupling Capacitor Layout FWH Flash Bios VPP Design Guidelines FWH Flash Bios GuidelinesIn-Circuit FWH Flash Bios Programming PCI Interface ICH2 Design ChecklistChecklist Items Recommendations Reason/Effect FWH Flash Bios Interface Hub InterfaceLAN Interface Eeprom Interface Interrupt Interface PIRQ#DAPIRQ#H PIRQ#E VCCSUS3.3 GpioUSB Interface Processor Signals AC’97 System ManagementRTC Miscellaneous Signals PowerSpkr 5VREF SUS IDE Checklist ICH2 AD22 / ISA ISA Bridge ChecklistChecklist Items ICH2 Layout Checklist Bit Hub InterfaceIDE Interface USB LAN Connect I/F ICH2 Decoupling CK-SKS Clocking Layout Recommendations Yes 138 Design Guide Terminology and Definitions Term Definition 140 Design Guide AGTL+ Design Guidelines Guideline Methodology Equation 4. Setup Time Initial Timing AnalysisEquation 5. Hold Time Equation 6. Maximum Flight Time AGTL+ Parameters for Example Calculations1,2 IC Parameters Pentium Intel Example Tfltmax Calculations for 133 MHz Bus1 Driver Receiver Clk Determine the Desired General Topology, Layout, and Routing Pre-Layout SimulationMethodology Sensitivity Analysis Monte Carlo Analysis Simulation Criteria Layout and Route Board Estimate Component-to-Component Spacing for AGTL+ SignalsPlace and Route Board Crosstalk Type Trace WidthSpace Ratio Host Clock Routing Apic Data Bus RoutingTrace Width Space Guidelines Intersymbol Interference Post-Layout Simulation Measurements Flight Time Simulation ValidationCrosstalk Analysis SET Q CLR Q Equation 8. Valid Delay EquationFlight Time Hardware Validation Timing Requirements TheoryAGTL+ Crosstalk Theory Aggressor and Victim Networks Potential Termination Crosstalk Problems More Details and Insight Textbook Timing Equations Power Distribution Effective Impedance and Tolerance/Variation One Signal Layer and One Reference Plane Reference Planes and PCB Stack-Up Layer Switch with Multiple Reference Planes Same Type High-Frequency Decoupling One Layer with Multiple Reference Planes Clock Routing Overdrive Region Vref Guard BandRingback Levels Conclusion Flight Time Definition and Measurement Number Name on CK133 Used for Routed to Frequency Voltage Clock GenerationIntel 820E Chipset Platform System Clocks Intel 820E Chipset Platform Clock Distribution LPCCLK, Pciclk Intel 820E Chipset Platform Clock SkewsRelationship Skew Pin-to-Pin ps Board ps Total ps Min Max Intel 820E Chipset Clock Routing Guidelines1,2 ±TBD3 Intel 820E Chipset Platform System Clock Cross-Reference CK133/DRCG Pin Name Component 2. CK133 to Drcg Component Placement and Interconnection Layout Requirements1 .318 MHz Crystal to CK133 MCH-to-DRCG Routing Diagram MCH to Drcg DRCG-to-RDRAM Channel Trace LengthTrace Geometry Clock From Length inches Section Differential Clock Routing Diagram Sections A, C & D Drcg Impedance Matching Circuit External Drcg Component Values1,2Component Nominal Value CMID, CMID2 AGP Clock Routing Guidelines Clock Routing Guidelines for Intel PGA370 DesignsSeries Termination Resistors for CK133 Clock Outputs Drcg Layout Example Unused Outputs Decoupling Recommendation for CK133 and DrcgUnused Output Termination Buffer Name CC Range Impedance If Unused Output Drcg Frequency Selection Table and Jitter Specification Drcg Frequency Selection and the DRCG+ DRCG+ Frequency Selection Schematic DRCG+ Frequency Selection Stack-Up Requirement PCB Materials Design Process Test Coupon Design Guidelines Recommended Stack-Up Inner-Layer RoutingStack-Up Examples Sample SM max Resin % Impedance Calculation Tools Field Solver vs. Zcalc Testing Board Impedance Board Impedance/Stack-up Summary 182 Design Guide Term Definition Power DeliveryTerminology and Definitions Intel 820E Chipset Power Delivery Example Dual Switch VCC Vbsy V and 2.5 V Power Sequencing Schottky Diode 3VSB ICH2 1.8 V / 3.3 V Power Sequencing VSB Example 1.8V/3.3V Power Sequencing Circuit 4 .3V/V5REF Sequencing Vref Excessive Power Consumption by 64/72-Mbit RdramOption 1 Reduce the Clock Frequency During Initialization Use a GPO to Reduce Drcg Frequency ICH2 Power Plane Split Example of ICH2 Power Plane Split Thermal Design Power FeaturesIntel 820E Chipset Component Thermal Design Power Component Thermal Design Power 133/400 MHz Glue Chip Vendors Vendor Intel Contact Contact Information Appendix a Reference Design Schematics Uniprocessor Reference Design Feature Set 196 Design Guide REV Drawn by PCG Platform Design Project PCG AEPrairie City Road FOLSOM, California Last Revised Sheet Block Diagram Device Table AK8 AH8AN9 AL9 CPURST#R2 DBRESET# VCMOS15Gtlref Tckr TDI Tmsr Clock Synthesizer Hubref Ramrefr RamrefConnagpref Hubref Agpref Ramrefb Ramrefa Gtlrefb Gtlrefa Host GAD0 GAD0 GAD1GAD1 GAD2 GAD2 GAD3 AD0 AD1AD2 AD3 ACRESET# CR4Vbatcr 1UF Rtcrstjp NC1 Gnda Fwhic Vcca LFRAME#/FWH4 NC3 NC4 INIT# HINIT# NC5 RFU36NC6 RFU35 FGPI4 RFU34 NC8 RFU33 Fwhpclk CLK RFU32 VCC10 VCC31 Vppr VPP GND30 PCIRST# GND29 SWP RSRV4/RESET RSRV4/RESET SWPTERMDQA80 Rimm LDQA0 Super I/O AC’97 Audio Micinr Micinfb MicinMicinc DB15AUDSTK Communication And Network Riser CNR Stubs on AC97 Link ACSDATAIN0ICH2 ACSYNCICH2 ACSDATAOUTICH2RP7 ACSDATAIN0CNR Acsynccnr Acsdataoutcnr LAN 82562EH 82562ET/EM LAN RJ11 For 82562EH Lanactled LAN RJ45 For 82562ET/EMH1138ARAGONITE 25MHZ Y5 Xtal Y2 Xtal LANCLKX1R381LANCLKX2 LAN Option Intel PART# Stuff for 82562EH Power SW Power LEDSW1 VCC12 Irtx AGP4XU20 AGPOC# TYPEDET#USBAGP+ B4 Usbagp Agpclkconn B7 CLK VCC5 VCC12 PCI3CON PTRST# PtckPtms Ptdi PCI Connectors IDE Connectors USB Connectors Port Parallel Serial Ports Keyboard/Mouse/Floppy Game Port VCC5 JOY1XR JOY2XR Midioutr JOY2YR JOY1YR Midiinr VRM Fault VRM IFB FAULT# IFBVccvid REV Project Imax VRM G1 VRM G2 Voltage Regulators 1UF-X7R VCC33SBYTG VCC33SBYSW VCC25SBYVCC5DUAL VCC33SBY VCC33SBYCOSC VCC33SBYRUN VCC33SBYITH SBY ITH R Power Connector BPRI# DBSY# HREQ#0 PCI/AGP Pullups/Pulldowns Rambus* Termination Termcmd Termsck Decoupling VCMOS18SBY Bulk Decoupling Drawn by PCG Platform Design Project PCG AE Revision History Revision History Drawn by PCG Platform Design Project PCG AE Hub Interface Connector For debug only Probe ConnectorTESTCLK66 HL0 HL1 HL2 HL3 HL9 Hlstb HLSTB# HL8 HL4 HL5 HL6 HL7