Intel® 820E Chipset
R
186 Design Guide
2.5 VBSY
The 2.5 VSBY power plane is used to power the RDRAM core and the VCMOS rail on the RDRAMs.
The RDRAM core requires an approximately 4.5-A maximum average DC current at 2.5 V. In the Intel
820E chipset reference board, the 2.5 VSBY plane is derived from the 5 V dual power plane using a
switching regulator. During the maximum load-step of 2 A, the maximum voltage fluctuation must be
less than 50 mV. The maximum tolerance for 2.5 V is 125 mV. However, during any 10 µs period, the
voltage cannot fluctuate more than 50 mV. The high-frequenc y bypassing requirements are satisfied
using capacitors on the RIMM itself. Low-frequency bypass req uirements vary depending on the voltage
regulator used. By using a switching regulator with a relatively slow response ti me, the low-frequency
bypass recommendation is eight 100 µF bulk capacitors (0.1- ESR) near the RIMM connectors. By
using a linear regulator with a substantially faster response time, the low-frequency bypass requirement
could be reduced.
The VCMOS rail requires a maximum of 3 mA at 1.8 V. This rail must be powered during Suspend to
RAM. Therefore, the VCMOS rail cannot be connected to the MCH core power. Because the current
requirements of VCMOS are so low, a resistor divider can be used to generate VCMOS from 2.5 VSBY.
The resistor divider should be 36 (top) / 100 (bottom). Additionally, it should be bypassed with a
0.1-µF chip capacitor.
The Intel reference board uses a switching regulator from 5 V dual. It may be possible to use a linear
regulator to regulate from 3.3 VSB. However, the thermal characteristics must be considered.
Additionally, a low-dropout linear regulator would be necessary. If 2.5 VSBY is regulated from 3.3 VSB,
the 3.3 VSB regulator must be able to supply enough current for all the 3 .3 VSB device requirements as
well as the 2.5 VSBY requirements.
Refer to the 1.8 V power plane information for 1.8 V and 2.5 V power sequencing requirements.
Note: This regulator is required in all designs. However, in systems that do not support STR, the 2.5 V rail is
powered from either the 3.3 V or 5 V core well.
1.8 V
The 1.8 V plane powers the MCH core, the ICH2 hub interface’s I/O buffers, and the RDRAM
termination resistors. This power plane has a total power requirement of approximately 1.7 A. The 1.8 V
plane should be decoupled with a 0.1 µF and 0.01 µF chip capacitor at each corner of the MCH and with
a single 1 µF and 0.1 µF capacitor at the ICH2.
Note: This regulator is required in all designs.
Power must not be applied to the RDRAM termination resistors (VTERM) before applying power to the
RDRAM core (2.5 VSBY in this design). This can be guaranteed by placing a Schottky diode between
1.8 V and 2.5 V, as shown in the Figure 102: