Intel 820E manual RSL Signal Layer Alternation

Intel® 820E Chipset

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The CTAB can be implemented on the multiple layers to minimize routing and space constraints. Figure 28 shows the use of CTABs on the top and bottom layer for bottom-layer RSL and clocking signals routed between RIMMs.

Figure 28. Bottom-Layer CTABs Split across the Top and Bottom Layer to Achieve an Effect CEFF ~1.35 pF

2.7.2.5.RSL Signal Layer Alternation

RSL signals must alternate layers as they are routed through the channel. If a signal is routed on the primary layer from the MCH to the first RIMM socket, it must be routed on the secondary layer from the first RIMM to the second RIMM, as shown in Figure 29 (signal B). If a signal is routed on the secondary layer from the MCH to the first RIMM socket, it must be routed on the primary side from the first RIMM to the second RIMM, as shown in Figure 29 (signal A). Signals can be routed on either layer from the last RIMM to the termination resistors.

Design Guide 49