Intel 820E manual AGP Clock Routing, General AGP Routing Guidelines, Recommendations, Decoupling

Intel® 820E Chipset

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2.8.5.AGP Clock Routing

The maximum total AGP clock skew (between the MCH and the graphics component) is 1 ns for all data transfer modes. This 1 ns includes skew and jitter that originates on the motherboard, add-in card, and clock synthesizer. Clock skew must be evaluated not only at a single threshold voltage, but at all points on the clock edge that fall within the switching range. The 1-ns skew budget is divided such that the motherboard is allotted 0.9 ns of clock skew. (The motherboard designer determines how the 0.9 ns are allocated between the board and the synthesizer.) For the Intel 820E chipset platform’s AGP clock routing guidelines, refer to Chapter 4 Clocking.

2.8.6.General AGP Routing Guidelines

The following routing guidelines are recommended for the optimal system design. The main focus of these guidelines is the minimization of signal integrity problems on the AGP interface of the Intel 820E chipset’s MCH. The following guidelines are not intended to replace thorough system validation on Intel 820E chipset-based products.

2.8.6.1.Recommendations

Decoupling

•For VDDQ decoupling, at least six 0.01-∝ F capacitors are required, of which at least four must be within 70 mils of the outer row of balls on the MCH. (See Figure 37.)

•Evenly distribute the placement of decoupling capacitors in the AGP interface signal field.

•Use a low-ESL ceramic capacitor (e.g., 0603 body type, X7R dielectric).

•In addition to the minimum decoupling capacitors, bypass capacitors should be placed at vias that transition AGP signals from one reference signal plane to another. In a typical four-layer PCB design, the signals transition from one side of the board to the other.

•One extra 0.01-∝ F capacitor is required per 10 vias. The capacitor should be placed as close as possible to the center of the via field.

•Ensure that the AGP connector is well decoupled, as described in the AGP Design Guide, Revision 1.0 (Section 1.5.3.3).

Note: To add the decoupling capacitors as close as possible to the MCH and/or close to the vias, the trace spacing may be reduced as the traces go around each capacitor. The narrowing of the space between traces should be minimal and for as short a distance as possible (1 inch max.).

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