Intel 820E - page 11

Intel® 820E Chipset

Design Guide 11

Table 45. USB........................................................................................................................134

Table 46. LAN Connect I/F.....................................................................................................135

Table 47. AC’97 .....................................................................................................................136

Table 48. ICH2 Decoupling.................................................................................................... 136

Table 49. CK-SKS Clocking................................................................................................... 137

Table 50. RTC........................................................................................................................137

Table 51. AGTL+ Parameters for Example Calculations1,2.................................................... 143

Table 52. Example TFLT_MAX Calculations for 133 MHz Bus1.................................................. 144

Table 53. Example TFLT_MIN Calculations1 (Frequency Independent)..................................... 145

Table 54. Trace Width Space Guidelines ..............................................................................148

Table 55. Intel® 820E Chipset Platform System Clocks......................................................... 163

Table 56. Intel® 820E Chipset Platform Clock Skews............................................................ 165

Table 57. Intel® 820E Chipset Platform System Clock Cross-Reference .............................. 167

Table 58. Placement Guidelines for Motherboard Routing Lengths (Direct RDRAM*

Clock Routing Length Guidelines) ..........................................................................170

Table 59. External DRCG Component Values....................................................................... 172

Table 60. Unused Output Termination................................................................................... 174

Table 61. 28 Ω Stack-Up Examples....................................................................................... 179

Table 62. 3D Field Solver vs. ZCALC.................................................................................... 180

Table 63. Intel® 820E Chipset Component Thermal Design Power....................................... 193

Table 64. Glue Chip Vendors................................................................................................. 194