Design Guide
Intel 820E Chipset
 Intel 820E Chipset
 Contents
 1.1
 102
 AGTL+
 191
 Figures
 CDCDNENAB# Support Circuitry for Multi-Channel Audio Upgrade
 Mil Stack-Up
Tables
 135
 Rev Description Date
Revision History
 About This Design Guide
Introduction
 Reference Documents
 System Overview
 Controller Hub 2 ICH2
Chipset Components
Memory Controller Hub MCH
 Intel 820E Chipset Platform Bandwidth Summary
FWH Flash Bios
Bandwidth Summary
ISA Bridge
 MCH
System Configuration
 UltraATA/100/66/33 USB Ports 2 HC AC97 Codecs
 AGP
Platform Initiatives
Direct Rambus RAM Rdram
Streaming Simd Extensions
 Manageability
Integrated LAN Controller
Ultra ATA/100 Support
Expanded USB Support
 Interrupt Controller
Function Disable
Intruder Detect
SMBus
 9. AC’97
 Ebga
C AC’97 Connections
 Low-Pin-Count LPC Interface
 This page is intentionally left blank
 Component Quadrant Layout
General Recommendations
 MCH
 Sample ATX and NLX MCH/ICH2 Component Placement
Intel 820E Chipset Component Placement
 Primary-Side MCH Core Routing Example ATX
Core Chipset Routing Recommendations
 Secondary-Side MCH Core Routing Example ATX
 Data Strobing Example
Source-Synchronous Strobing
 Data Associated Strobe
Differential Clocking/Strobing
Direct RDRAM* Interface
AGP 2× Data/Strobe Association
 Direct RDRAM* Layout Guidelines
Stack-Up
 Reference Trace Description Maximum Trace Length
Placement Guidelines for Motherboard Routing Lengths
RSL Routing
 RSL Routing Diagram
 Secondary-Side RSL Breakout Example
 Direct Rdram Termination
RSL Termination
 Direct RDRAM* Termination Example
Direct RDRAM* Ground Plane Reference
 GND Plane
Plane
 Equation 1. Approximate Copper Tab Area Calculation
Direct RDRAM* Connector Compensation
 Copper Tab Area Calculation
 Connector Compensation Example
 Section a See Note, Top Layer
 Section a See Note, Bottom Layer
 Section B See Note, Top Layer
 Section B See Note, Bottom Layer
RSL and Clocking Signal Routing Layer Capacitance pF
 Flood Signal
 RSL Signal Layer Alternation
 RSL Routing Layer Requirements
Length Matching Methods
 Equation 3. Rdram Clock Signal Trace Length Calculation
Equation 2. Rdram RSL Signal Trace Length Calculation
 Length Matching and Via Compensation Example
Via Compensation
 Signal Ball on Nominal Package
 High-Speed Cmos Routing
Direct RDRAM* Reference Voltage
 High-Speed Cmos Termination
SIO Routing
 Rdram Cmos Shunt Transistor
Suspend-to-RAM Shunt Transistor
 Direct RDRAM* Clock Routing
Direct RDRAM* Design Checklist
Signal List
RSL Signals High-Speed Serial Clocks
 Intel 820E Chipset
 Primary side
If Signal Routed from MCH
 AGP
AGP Interface Signal Groups
 Signal Groups
 AGP 2.0 Data/Strobe Associations
2 × Timing Domain Routing Guidelines
3 ×/4× Timing Domain Routing Guidelines
Interfaces 6 Inches
 AGP 2×/4× Routing Example for Interfaces 6 Inches
Interfaces 6 Inches and 7.25 Inches
 AGP 2.0 Routing Summary1,2
Signal Maximum Trace Spacing Length Relative To
AGP 2.0 Routing Summary
All AGP Interfaces
 Decoupling
AGP Clock Routing
General AGP Routing Guidelines
Recommendations
 Ground Reference
Vddq Generation and TYPEDET#
 TYPEDET# on Add-in Card DDQ Supplied by MB
TYPDET#/VDDQ Relationship
 AGP Vddq Generation Example Circuit
Vref Generation for AGP 2.0 2× and 4×
 AGP 2.0 Vref Generation and Distribution
 16 k Ω
Compensation
AGP Pull-Ups
 Motherboard / Add-in Card Interoperability
AGP Signal Voltage Tolerance List
Connector / Add-in Card Interoperability
Connector Universal Connector
 AGP Left-Handed Retention Mechanism
AGP Universal Retention Mechanism RM
 AMP P/N
AGP Left-Handed RM Keep-Out Information
 Hub Interface
Hub Interface Signal Routing Example
 Bit Hub Interface Routing Guidelines
Bit Hub Interface Data Signals
Bit Hub Interface Strobe Signals
Bit Hub Interface Buffer Configuration Setting
 MCH ICH2 Hlrefa Hubref
Bit Hub Interface Hubref Generation Circuit Specifications
 Component Hub Interface Trace Rcomp Resistor Value
Bit Hub Interface Compensation
Bit Hub Interface Decoupling Guidelines
Bit Hub Interface Rcomp Resistor Values
 Minimizing Crosstalk on the AGTL+ Interface
Additional Host Bus Guidelines
System Bus Ground Plane Reference
 Cable
IDE Interface
Additional Considerations
 Combination Host-Side/Device-Side Cable Detection
Cable Detection for Ultra ATA/66 and Ultra ATA/100
 Combination Host-Side/Device-Side IDE Cable Detection
 Device-Side IDE Cable Detection
Device-Side Cable Detection
 Primary IDE Connector Requirements
 Siordy IRQ15 SDDACK#
Secondary IDE Connector Requirements
SDCS1# SDCS3# SDIOR# SDIOW# Sddreq
 ICH2 AC’97- Codec Connection
13. AC’97
 Intel 820E Chipset
 Motherboard CNR Board
 CNR
 CDCDNENAB#
Signal Descriptions
AC97RESET#
 Invalid Codec Configurations
Valid Codec Configurations
Codec Configurations
Valid Codec Configurations
 13.3. AC’97 Routing
 Motherboard Implementation
Using Native USB Interface
USB
 Disabling the Native USB Interface of ICH2
Recommended USB trace characteristics
ISA Support
 SMBus/SMLink Interface
16. I/O Apic Design Recommendation
 SMBus / SMLink Use Implementation
Pull-Up Requirements for SMBus and SMLink Signals
 RTC
PCI
 External Capacitors
RTC Crystal
 RTC Layout Considerations
RTC External Battery Connection
 Rtcrst External Circuit for ICH2 RTC
RTC External Rtcrst Circuit
 RTC-Well Input Strap Requirements
Spkr Pin Consideration
RTC Routing Guidelines
Vbias DC Voltage and Noise Measurements
 Usage of I/O Apic Interrupt Inputs 16 through
Function in ICH2 using the PCI IRQ in Ioapic
ICH2 Pirq Routing
 PIRQE# PIRQF# PIRQG# PIRQH# Inta Intb Intc Intd
LAN Connect Component Connection Features
LAN Layout Guidelines
PIRQA# PIRQB# PIRQC# PIRQD#
 Layout Section Previous Design Guide Section
ICH2 LAN Interconnect Guidelines
LAN Design Guide Section Reference
 LOM/CNR Interconnect
Bus Topologies
Point-to-Point Interconnect
 Length Requirements for Figure
Signal Routing and Layout
Configuration
 Line Termination
Crosstalk Consideration
Impedances
 General Trace Routing Considerations
General LAN Routing Guidelines and Considerations
 Trace Geometry and Length
Power and Ground Connections
 Ground Plane Separation
 Layer Board Design
 Design Guide 111
 Related Documents
Guidelines for Intel 82562EH Component Placement
Intel 82562EH Home/PNA* Guidelines
Crystals and Oscillators
 Intel 82562EH Component Termination
Phoneline Hpna Termination
 Distance Priority Guideline
Critical Dimensions
LPF
Eeprom
 Distance from LPF to Phone RJ11
Intel 82562ET / Intel 82562EM Component Guidelines
 Intel 82562ET/82562EM Component Termination
 Distance from Magnetics Module to RJ45
 Terminating Unused Connections
Reducing Circuit Inductance
 LAN Disable Circuit
Intel 82562ET/EM Disable Guidelines
 Lancl
 Dual-Footprint Analog Interface
 Decoupling Capacitor Recommendation
Power Plane/Pins # Decoupling Capacitor Value
ICH2 Decoupling Recommendations
 Decoupling Capacitor Layout
 FWH Flash Bios VPP Design Guidelines
FWH Flash Bios Guidelines
In-Circuit FWH Flash Bios Programming
 PCI Interface
ICH2 Design Checklist
Checklist Items Recommendations Reason/Effect
 Eeprom Interface
FWH Flash Bios Interface
Hub Interface
LAN Interface
 PIRQ#E
Interrupt Interface
PIRQ#DA
PIRQ#H
 VCCSUS3.3
Gpio
USB Interface
 Processor Signals
 AC’97
System Management
RTC
 5VREF SUS
Miscellaneous Signals
Power
Spkr
 IDE Checklist
 ICH2 AD22 / ISA
ISA Bridge Checklist
Checklist Items
 USB
ICH2 Layout Checklist
Bit Hub Interface
IDE Interface
 LAN Connect I/F
 ICH2 Decoupling
 Layout Recommendations Yes
CK-SKS Clocking
 138 Design Guide
 Term Definition
Terminology and Definitions
 140 Design Guide
 Guideline Methodology
AGTL+ Design Guidelines
 Equation 6. Maximum Flight Time
Equation 4. Setup Time
Initial Timing Analysis
Equation 5. Hold Time
 IC Parameters Pentium Intel
AGTL+ Parameters for Example Calculations1,2
 Driver Receiver Clk
Example Tfltmax Calculations for 133 MHz Bus1
 Sensitivity Analysis
Determine the Desired General Topology, Layout, and Routing
Pre-Layout Simulation
Methodology
 Simulation Criteria
Monte Carlo Analysis
 Layout and Route Board
Estimate Component-to-Component Spacing for AGTL+ Signals
Place and Route Board
 Crosstalk Type Trace WidthSpace Ratio
Host Clock Routing Apic Data Bus Routing
Trace Width Space Guidelines
 Post-Layout Simulation
Intersymbol Interference
 Measurements Flight Time Simulation
Validation
Crosstalk Analysis
 SET Q CLR Q
Equation 8. Valid Delay Equation
Flight Time Hardware Validation
 Timing Requirements
Theory
AGTL+
 Aggressor and Victim Networks
Crosstalk Theory
 Potential Termination Crosstalk Problems
 Textbook Timing Equations
More Details and Insight
 Effective Impedance and Tolerance/Variation
Power Distribution
 Reference Planes and PCB Stack-Up
One Signal Layer and One Reference Plane
 Layer Switch with Multiple Reference Planes Same Type
 One Layer with Multiple Reference Planes
High-Frequency Decoupling
 Clock Routing
 Overdrive Region
Vref Guard Band
Ringback Levels
 Flight Time Definition and Measurement
Conclusion
 Number Name on CK133 Used for Routed to Frequency Voltage
Clock Generation
Intel 820E Chipset Platform System Clocks
 Intel 820E Chipset Platform Clock Distribution
 LPCCLK, Pciclk
Intel 820E Chipset Platform Clock Skews
Relationship Skew Pin-to-Pin ps Board ps Total ps Min Max
 ±TBD3
Intel 820E Chipset Clock Routing Guidelines1,2
 CK133/DRCG Pin Name Component
Intel 820E Chipset Platform System Clock Cross-Reference
 2. CK133 to Drcg
Component Placement and Interconnection Layout Requirements
1 .318 MHz Crystal to CK133
 MCH to Drcg
MCH-to-DRCG Routing Diagram
 Clock From Length inches Section
DRCG-to-RDRAM Channel
Trace Length
Trace Geometry
 Differential Clock Routing Diagram Sections A, C & D
 CMID, CMID2
Drcg Impedance Matching Circuit
External Drcg Component Values1,2
Component Nominal Value
 Drcg Layout Example
AGP Clock Routing Guidelines
Clock Routing Guidelines for Intel PGA370 Designs
Series Termination Resistors for CK133 Clock Outputs
 Buffer Name CC Range Impedance If Unused Output
Unused Outputs
Decoupling Recommendation for CK133 and Drcg
Unused Output Termination
 Drcg Frequency Selection and the DRCG+
Drcg Frequency Selection Table and Jitter Specification
 DRCG+ Frequency Selection
DRCG+ Frequency Selection Schematic
 PCB Materials
Stack-Up Requirement
 Test Coupon Design Guidelines
Design Process
 Sample SM max Resin %
Recommended Stack-Up
Inner-Layer Routing
Stack-Up Examples
 Field Solver vs. Zcalc
Impedance Calculation Tools
 Board Impedance/Stack-up Summary
Testing Board Impedance
 182 Design Guide
 Term Definition
Power Delivery
Terminology and Definitions
 Intel 820E Chipset Power Delivery Example
 VCC
Dual Switch
 Vbsy
 3VSB
V and 2.5 V Power Sequencing Schottky Diode
 VSB
ICH2 1.8 V / 3.3 V Power Sequencing
 4 .3V/V5REF Sequencing
Example 1.8V/3.3V Power Sequencing Circuit
 Vref
Excessive Power Consumption by 64/72-Mbit Rdram
Option 1 Reduce the Clock Frequency During Initialization
 Use a GPO to Reduce Drcg Frequency
 Example of ICH2 Power Plane Split
ICH2 Power Plane Split
 Component Thermal Design Power 133/400 MHz
Thermal Design Power
Features
Intel 820E Chipset Component Thermal Design Power
 Vendor Intel Contact Contact Information
Glue Chip Vendors
 Reference Design Feature Set
Appendix a Reference Design Schematics Uniprocessor
 196 Design Guide
 FOLSOM, California Last Revised Sheet
REV
Drawn by PCG Platform Design Project PCG AE
Prairie City Road
 Device Table
Block Diagram
 AL9
AK8
AH8
AN9
 Tckr TDI Tmsr
CPURST#R2 DBRESET#
VCMOS15
Gtlref
 Clock Synthesizer
 Hubref Agpref Ramrefb Ramrefa Gtlrefb Gtlrefa Host
Hubref Ramrefr
Ramref
Connagpref
 GAD2 GAD3
GAD0
GAD0 GAD1
GAD1 GAD2
 AD3
AD0
AD1
AD2
 Rtcrstjp
ACRESET#
CR4
Vbatcr 1UF
 VCC10 VCC31 Vppr VPP GND30 PCIRST# GND29
NC1 Gnda
Fwhic Vcca LFRAME#/FWH4 NC3 NC4 INIT# HINIT# NC5 RFU36
NC6 RFU35 FGPI4 RFU34 NC8 RFU33 Fwhpclk CLK RFU32
 Rimm LDQA0
SWP RSRV4/RESET
RSRV4/RESET SWP
TERMDQA80
 Super I/O
 AC’97 Audio
 DB15AUDSTK
Micinr Micinfb
Micin
Micinc
 Communication And Network Riser CNR
 ACSDATAIN0CNR Acsynccnr Acsdataoutcnr
Stubs on AC97 Link
ACSDATAIN0ICH2 ACSYNCICH2 ACSDATAOUTICH2
RP7
 LAN 82562EH
 82562ET/EM
 LAN RJ11 For 82562EH
 Lanactled
LAN RJ45 For 82562ET/EM
H1138ARAGONITE
 LAN Option Intel PART#
25MHZ
Y5 Xtal Y2 Xtal LANCLKX1
R381LANCLKX2
 Stuff for 82562EH
 VCC12 Irtx
Power SW
Power LED
SW1
 Agpclkconn B7 CLK
AGP4XU20 AGPOC#
TYPEDET#
USBAGP+ B4 Usbagp
 Ptdi
VCC5 VCC12
PCI3CON PTRST# Ptck
Ptms
 PCI Connectors
 IDE Connectors
 USB Connectors
 Port Parallel
 Serial Ports
 Keyboard/Mouse/Floppy
 VCC5 JOY1XR JOY2XR Midioutr JOY2YR JOY1YR Midiinr
Game Port
 Imax VRM G1 VRM G2
VRM Fault VRM IFB
FAULT# IFB
Vccvid REV Project
 Voltage Regulators
 SBY ITH R
1UF-X7R
VCC33SBYTG VCC33SBYSW VCC25SBY
VCC5DUAL VCC33SBY VCC33SBYCOSC VCC33SBYRUN VCC33SBYITH
 Power Connector
 HREQ#0
BPRI# DBSY#
 PCI/AGP Pullups/Pulldowns
 Termcmd Termsck
Rambus* Termination
 Decoupling
 Bulk Decoupling Drawn by PCG Platform Design Project PCG AE
VCMOS18SBY
 Revision History Drawn by PCG Platform Design Project PCG AE
Revision History
 HL8 HL4 HL5 HL6 HL7
Hub Interface Connector For debug only
Probe Connector
TESTCLK66 HL0 HL1 HL2 HL3 HL9 Hlstb HLSTB#