Intel 820E manual Introduction, About This Design Guide

Intel® 820E Chipset

R

1.Introduction

The Intel® 820E Chipset Design Guide provides design recommendations for systems using the Intel® 820E chipset. This includes motherboard layout, routing guidelines, system design issues, system requirements, debug recommendations, and board schematics. In addition to providing motherboard design recommendations (e.g., layout and routing guidelines), this document also addresses system design issues such as thermal requirements for Intel 820E chipset-based systems. The design recommendations should be used during system design. The guidelines have been developed to provide maximum flexibility to board designers while reducing the risk of board-related issues.

The Intel board schematics in Appendix A: Reference Design Schematics (Uniprocessor) implement Intel® PGA370 architecture and are intended for use as references by board designers. While the schematics included cover specific designs, the core schematics for each chipset component remain the same for most Intel 820E chipset platforms. The appendix provides a set of reference schematics for each chipset component, in addition to common motherboard options. Additional flexibility is possible via other permutations of these options and components.

1.1.About This Design Guide

This design guide is intended for hardware designers who are experienced with PC architectures and board design. This design guide assumes that the designer has a working knowledge of the vocabulary and practices of PC hardware design.

•Chapter 1, Introduction — This chapter introduces the designer to the purpose and organization of this design guide, and provides a list of references of related documents. This chapter also provides an overview of the Intel 820E chipset.

•Chapter 2, Layout/Routing Guidelines — This chapter provides a detailed set of motherboard layout and routing guidelines for designing an Intel 820E chipset-based platform. The motherboard’s functional units are discussed (e.g., chipset component placement, system bus routing, system memory layout, display cache interface, hub interface, IDE, AC’97, USB, interrupts, SMBUS, PCD, LPC/FWH Flash BIOS, and RTC).

•Chapter 4, Advanced System Bus Design — This chapter discusses the AGTL+ guidelines and theory of operation. It also provides more details about the methodologies used to develop these guidelines.

•Chapter 4, Clocking — This chapter provides the motherboard clocking guidelines (e.g., clock architecture, routing, capacitor sites, clock power decoupling, and clock skew).

•Chapter 5, System Manufacturing — This chapter includes the board stack-up requirements.

•Chapter 6, System Design Considerations— This chapter includes the guidelines for power delivery, decoupling, thermal, and power sequencing.

•Appendix A, Reference Design Schematics (Uniprocessor) — This appendix provides a set of schematics for uniprocessor designs. It also provides a feature list for board design.

Design Guide 13