Intel® 820E Chipset

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6.1.2.Power Delivery of Intel® 820E Chipset Customer Reference Board

Figure 101 shows the power delivery architecture for the Intel 820E Chipset Reference Board. This power delivery architecture supports the Instantly Available PC Design Guidelines via the Suspend-to- RAM (STR) state. During STR, only the necessary devices are powered. These devices include main memory, the ICH2 resume well, PCI wake devices (via 3.3 VAUX), and USB. (USB can be powered only if sufficient standby power is available.) To ensure that enough power is available during STR, a thorough power budget must be completed. The power requirements must include each device’s power requirements, both in the suspend and full-power states. The power requirements must be compared with the power budget available from the power supply. Due to the requirements of main memory and PCI 3.3 VAUX—and possibly other devices in the system—it is necessary to create a dual power rail.

Figure 101. Intel® 820E Chipset Power Delivery Example

 

ATX P/S

 

VRM

PGA370 Core: VCC_VID

 

 

 

with 1A 5VSB

 

 

 

 

 

22A** S0, S1

 

MBR 2.0 82562EH,

 

 

 

 

 

12V, 3.3V,

 

 

 

 

 

 

5VSB

5V

 

 

VTT

PGA370 VTT: 1.5V

82562ET, (PHY) +

3.3V

12V

3.3VSB, 5V,

 

 

 

 

Regulator

2.7A** S0, S1

5VDUAL

Modem Codec S0, S1,

 

 

 

 

 

 

 

S3, S5

 

 

 

 

 

CPU CMOS P/Us: 1.5V

 

5V Dual

 

 

 

 

 

 

 

Switch

 

 

 

2.5VSBY

 

 

DRCG: 3.3V

 

 

 

 

 

 

 

 

 

 

Regulator

 

Diode for

100mA S0, S1

 

 

 

 

 

 

 

 

 

 

 

 

MCH Core: 1.8V

Sequencing

RDRAM Core: 2.5V

 

 

 

 

CK133-2.5:

MCH Hub I/F I/O: 1.8V

 

 

 

 

 

950mA S0, S1

RDRAM VTerm: 1.8V

2.0A S0, S1; 32ma S3

 

 

 

 

2.5V

MCH VDDQ: 1.5V/3.3V*

 

 

 

 

 

CK133-3.3:

704mA S0, S1

 

 

 

 

 

2A S0, S1

 

VCC CMOS: 1.8V

 

 

 

 

3.3V

 

 

 

 

 

 

 

 

3mA S0, S1, S3

 

 

 

 

1.8V

ICH2

 

 

 

 

 

 

Regulator

VccCPU-VRM out

 

 

 

 

 

 

 

10mA S0, S1

 

 

 

 

 

 

VDDQ

Vcc1_8-Hub I/F I/O: 1.8V

 

 

 

 

 

 

300mA S0, S1

 

 

 

 

 

 

Regulator

VCC2_5 Voltage

 

 

 

 

 

V5Ref: 5V

 

 

 

 

 

 

Regulator: 2.5V

 

 

 

 

 

 

<10uA S0, S1

 

 

 

 

 

 

 

 

 

 

 

 

 

Vcc3_3: 3.3V

 

 

 

 

 

 

 

<300mA S0, S1

 

 

 

 

 

 

 

VccSus3_3-ICH Resume:

 

 

 

 

 

3.3VSB

3.3V

PCI 3.3Vaux: 3.3V

 

 

 

 

20mA S0, S1; 300uA S3,S5

 

 

 

 

Regulator

VccSus1_8-ICH Resume:

1.5A S0, S1; 435ma S3, S5

 

 

 

 

 

 

 

 

 

 

 

 

1.8VSB

1.8V

LPC Super I/O: 3.3V

 

 

 

 

 

Regulator

210mA S0, S120mA S3, S5

 

 

 

 

 

 

 

 

 

 

 

 

VccRTC-ICH RTC: Vbat

FWH Flash BIOS

 

 

 

 

 

USB Cable

<4uA S0, S1, S3, S5

 

 

 

 

 

V5RefSus: 5VSB

Core: 3.3V

 

 

 

 

 

Power: 5V

67mA S0, S1

 

 

 

 

 

 

<10uA S0,S1,S3,S5

 

 

 

 

 

AC'97 Audio

 

 

 

 

 

 

 

 

 

 

 

 

 

Codec: 5V

 

 

 

2.5V

1.8V

* Vddq also connects to the AGP connector. 2A is the TOTAL VDDQ current requirement.

**Refer to the Pentium® III processor datasheet for power requirement considerations for PGA370 designs. The Pentium® III processor datasheet can be found at: http://developer.intel.com/design/PentiumIII/datashts/

Shaded regulators/components are on in S3, S5 (Note RDRAM core and VCC CMOS must be OFF in S5)

LEGEND:

ATX Power Planes

Intel® 820E Chipset

Power Planes

 

 

5VSB

 

 

 

5V Dual

 

 

 

 

 

 

 

5V

 

 

 

VCCVID

 

 

 

 

 

 

 

3.3V

 

 

 

VTT

 

 

 

 

 

 

 

12V

 

 

 

2.5VSBY

 

 

 

 

 

 

 

 

 

 

 

1.8V

VDDQ 3.3VSB 2.5V 1.8VSB

Pwr_Delivery

184

Design Guide

Page 184
Image 184
Intel manual Intel 820E Chipset Power Delivery Example