Cypress CY7C604XX manual Package Diagram, Packaging Dimensions

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CY7C604XX

Package Diagram

This section illustrates the packaging specifications for the enCoRe V LV device, along with the thermal impedances for each package.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the enCoRe V LV emulation tools and their dimensions, refer to the development kit.

Packaging Dimensions

Figure 9. 16-Pin (3 x 3 mm) QFN (001-09116)

001-09116 *D

Document Number: 001-12395 Rev *H

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Contents EnCoRe V LV Block Diagram FeaturesEnCoRe Low VoltageEnCoRe V LV Core Functional Overview Getting StartedAdditional System Resources PSoC Designer Software Subsystems Development ToolsDesigning with PSoC Designer Configure ComponentsSelect Components Organize and ConnectAcronyms Used Document ConventionsUnits of Measure Numeric NamingPin Part Pinout Pin ConfigurationVss Ground connection Pin Part Pinout QFN Pin No Type Name DescriptionP16 Digital I/O P00 Digital I/O P30 Digital I/O P32 P20 P22 P24 P26P02 Digital I/O P06 Digital I/OP15 Digital I/O, I2C SDA, SPI Miso No connection Top ViewVdd Supply voltage No connection Vss Supply ground No connectionVss Supply ground P01 Digital I/ORegister Conventions Register ReferenceRegister Mapping Tables Register Conventions DescriptionRegister Map Bank 0 Table User Space Name Addr 0,Hex AccessName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceUnits of Measure Symbol Unit of Measure Electrical SpecificationsADC Electrical Specifications DC Chip Level Specifications DC Electrical CharacteristicsMaximum Ratings Operating ConditionsDC General Purpose I/O Specifications High Output Voltage Vdd Port 2 or 3 Pins Current in all I/OsInput Low Voltage Vdd Sink current on odd port pins for Example, P03 and P15Input High Voltage Vdd Input Hysteresis Voltage DC Programming Specifications DC POR and LVD SpecificationsAC Chip Level Specifications AC Electrical CharacteristicsAC General Purpose IO Specifications AC Programming Specifications AC External Clock SpecificationsAC SPI Specifications Symbol Description Min Typ Max Units AC SPI SpecificationsWidth of SS Negated Between Transmissions AC I2C Specifications Packaging Dimensions Package DiagramPin 5 x 5 x 0.55 mm QFN 125 Package HandlingThermal Impedances Solder Reflow Peak TemperatureOrdering Information Document History Worldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal Information