Cypress CY7C604XX manual Document History

Page 29

CY7C604XX

Document History Page

Document Title: CY7C604XX, enCoRe™ V Low Voltage Microcontroller

Document Number: 001-12395

 

 

Rev.

ECN No.

Orig. of

Submission

Description of Change

Change

Date

 

 

 

**

626516

TYJ

See ECN

New data sheet

 

 

 

 

 

*A

735721

TYJ/ARI

See ECN

Added new block diagram, replaced TBDs, corrected values, updated pinout infor-

 

 

 

 

mation, changed part number to reflect new specifications.

*B

1120504

ARI

See ECN

Corrected the description to pin 29 on Table 1, the Typ/Max values for ISB0 on the

 

 

 

 

DC chip-level specifications, and the Min voltage value for VddIWRITE in the DC

 

 

 

 

Programming Specifications table.

 

 

 

 

Corrected Flash Write Endurance minimum value in the DC Programming Speci-

 

 

 

 

fications table.

 

 

 

 

Corrected the Flash Erase Time max value and the Flash Block Write Time max

 

 

 

 

value in the AC Programming Specifications table.

 

 

 

 

Implemented new latest template.

*C

1225864

AESA/ARI

See ECN

Corrected the description to pin 13, 29 on Table 1 and 22,44 on Table 2.

 

 

 

 

Added sections Register Reference, Register Conventions and Register Mapping

 

 

 

 

Tables. Corrected Max values on the DC Chip-Level Specifications table.

*D

1446763

AESA

See ECN

Changed TERASEB parameter, max value to 18ms in Table 13, AC Programming

 

 

 

 

Specification.

*E

1639963

AESA

See ECN

Post to www.cypress.com

 

 

 

 

 

*F

2138889

TYJ/PYRS

See ECN

Updated Ordering Code table:

 

 

 

 

- Ordering code changed for 32-QFN package: From -32LKXC to -32LTXC

 

 

 

 

- Added a new package type – “LTXC” for 48-QFN

 

 

 

 

- Included Tape and Reel ordering code for 32-QFN and 48-QFN packages

 

 

 

 

Changed active current values at 24, 12 and 6MHz in table “DC Chip-Level Speci-

 

 

 

 

fications”

 

 

 

 

- IDD24: 2.15 to 3.1mA

 

 

 

 

- IDD12: 1.45 to 2.0mA

 

 

 

 

- IDD6: 1.1 to 1.5mA

 

 

 

 

Added information on using P1[0] and P1[1] as the I2C interface during POR or

 

 

 

 

reset events

*G

2583853

TYJ/PYRS/

10/10/08

Converted from Preliminary to Final

 

 

HMT

 

ADC resolution changed from 10-bit to 8-bit

 

 

 

 

On Page1, SPI Master and Slave – speeds changed

 

 

 

 

Rephrased battery monitoring clause in page 1 to include “with external compo-

 

 

 

 

nents”

 

 

 

 

Included ADC specifications table

 

 

 

 

Voh5, Voh7, Voh9 specs changed

 

 

 

 

Flash data retention – condition added to Note [15]

 

 

 

 

Input leakage spec changed to 25 nA max

 

 

 

 

Under AC Char, Frequency accuracy of ILO corrected

 

 

 

 

GPIO rise time for ports 0,1 and ports 2,3 made common

 

 

 

 

AC Programming specifications updated

 

 

 

 

Included AC Programming cycle timing diagram

 

 

 

 

AC SPI specification updated

 

 

 

 

Spec change for 32-QFN package

 

 

 

 

Input Leakage Current maximum value changed to 1 uA

 

 

 

 

Maximum specification for VOH5A parameter changed from 2.0 to 2.1V

 

 

 

 

Minimum voltages for FSPIM and FSPIS specifications changed from 1.8V to 1.71V

 

 

 

 

(Table 18)

 

 

 

 

Updated VOHV parameter in Table 13

 

 

 

 

Updated Thermal impedance values for the packages - Table 20.

 

 

 

 

Update Development Tools, add Designing with PSoC Designer. Edit, fix links and

 

 

 

 

table format. Update TMs. Update maximum data in Table 12. DC POR and LVD

 

 

 

 

Specifications.

Document Number: 001-12395 Rev *H

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Contents EnCoRe V LV Block Diagram FeaturesEnCoRe Low VoltageAdditional System Resources Functional Overview Getting StartedEnCoRe V LV Core PSoC Designer Software Subsystems Development ToolsDesigning with PSoC Designer Configure ComponentsSelect Components Organize and ConnectAcronyms Used Document ConventionsUnits of Measure Numeric NamingPin Part Pinout Pin ConfigurationP16 Digital I/O Pin Part Pinout QFN Pin No Type Name DescriptionVss Ground connection P00 Digital I/O P30 Digital I/O P32 P20 P22 P24 P26P02 Digital I/O P06 Digital I/OP15 Digital I/O, I2C SDA, SPI Miso No connection Top ViewVdd Supply voltage No connection Vss Supply ground No connectionVss Supply ground P01 Digital I/ORegister Conventions Register ReferenceRegister Mapping Tables Register Conventions DescriptionRegister Map Bank 0 Table User Space Name Addr 0,Hex AccessName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceUnits of Measure Symbol Unit of Measure Electrical SpecificationsADC Electrical Specifications DC Chip Level Specifications DC Electrical CharacteristicsMaximum Ratings Operating ConditionsDC General Purpose I/O Specifications High Output Voltage Vdd Port 2 or 3 Pins Current in all I/OsInput High Voltage Vdd Input Hysteresis Voltage Sink current on odd port pins for Example, P03 and P15Input Low Voltage Vdd DC Programming Specifications DC POR and LVD SpecificationsAC General Purpose IO Specifications AC Electrical CharacteristicsAC Chip Level Specifications AC Programming Specifications AC External Clock SpecificationsWidth of SS Negated Between Transmissions AC SPI SpecificationsAC SPI Specifications Symbol Description Min Typ Max Units AC I2C Specifications Packaging Dimensions Package DiagramPin 5 x 5 x 0.55 mm QFN 125 Package HandlingOrdering Information Solder Reflow Peak TemperatureThermal Impedances Document History Worldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal Information