Cypress CY7C604XX manual Package Handling, 125

CY7C604XX

Figure 11. 48-Pin (7 x 7 x 0.9 mm) QFN (001-13191)

001-13191 *C

Package Handling

Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade device reliability.

Table 21.Package Handling

Parameter	Description	Minimum	Typical	Maximum	Unit
TBAKETEMP	Bake Temperature		125	See package label	oC
TBAKETIME	Bake Time	See package label		72	hours

Document Number: 001-12395 Rev *H Page 27 of 30

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