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PCB Design and Performance
2.3Bill of Materials
The parts list, showing the components used in the assembly of the DAC8555EVM, is given in Table 1.
Table 1. DAC8555EVM Parts List
| QTY |
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| PER |
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| MFR |
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ITEM | BOARD | Ref Des | MFR | PART NUMBER | DESCRIPTION | |
1 | 4 | Panasonic | Chip Resistor, 0Ω, 1/10W, 0603 | |||
2 | 1 | R24 | Panasonic | Chip Resistor, 100Ω, 1/4W, 1206 | ||
Not | 2 | R5, R6 | Panasonic |
| Chip Resistor, 3kΩ, 1/10W, 0603 | |
Installed | ||||||
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3 | 7 | Panasonic | Chip Resistor, 10kΩ, 1/16W, 0603 | |||
R9 | ||||||
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4 | 1 | R16 | Panasonic | Chip Resistor, 20kΩ, 1/16W, 0603 | ||
5 | 1 | R10 | Bourns | Series 5T Pot., 20kΩ, BOURNS_32X4W | ||
6 | 1 | R15 | Bourns | Series 5T Pot., 100kΩ, BOURNS_32X4W | ||
Not | 7 | Panasonic |
| Chip Resistor, 1/4W 1206 | ||
Installed |
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7 | 1 | C12 | TDK | C1608C0G1H102J | Multilayer Ceramic Capacitor, 1nF, 0603 C0G | |
8 | 4 | TDK | C1608X7R1E104K | Multilayer Ceramic Capacitor, 0.1μF, 0603 X7R | ||
9 | 2 | C10, C11 | TDK | C2012X7R1E105K | Multilayer Ceramic Capacitor, 1μF, 0805 X7R | |
10 | 3 | C1, C2, C3 | TDK | C3216X7R1C106M | Multilayer Ceramic Capacitor, 10μF, 1206 X7R | |
Not | 2 | C8, C9 | TDK |
| Multilayer Ceramic Capacitor, 1206 | |
Installed |
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11 | 1 | U1 | Texas Instruments | DAC8555IPW | ||
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12 | 1 | U2 | Texas Instruments | OPA627AU | ||
13 | 1 | U3 | Texas Instruments | REF02AU | +5V, | |
14 | 1 | U4 | Texas Instruments | OPA2132UA | ||
Not | 2 | J1, J5 | ED555/3DS | |||
Installed | ||||||
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15 | 2 | J2A, J4A | Samtec | SMT Header, 10x2x0.1, | ||
16 | 1 | J3A | Samtec | SMT Header, 5x2x0.1, | ||
17 | 2 | J2B, J4B | Samtec | SMT Socket, 10x2x0.1, | ||
18 | 1 | J3B | Samtec | SMT Socket, 5x2x0.1, | ||
19 | 6 | Samtec | ||||
20 | 10 | Samtec | ||||
21 | 1 | TP4 | Keystone Electronics | 5011 | Testpoint, | |
Not | 5 | TP1, TP2, TP3, | Keystone Electronics | 5000 | Testpoint, | |
Installed | TP5, TP6 | |||||
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22 | 16 | N/A | Samtec | Shorting Block |
SLAU204 | DAC8555EVM User's Guide | 15 |
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