20 en Hardware InstallationRAID Subsystem
3.2 | Safety Precautions |
3.2.1 | Precautions and Instructions |
•
•
•
•
•
•
•
•
•
•
•
Be sure the correct power range
Thermal notice: All drive trays (even if they do not contain a hard drive) must be installed into the enclosure. Leaving a drive bay or module slot open will severely affect the airflow efficiency within the enclosure, and will consequently lead to system overheating. Keep a faulty module in place until you have a replacement unit and you are ready to replace it.
An enclosure without disk drives can weigh over 25 kilograms. Two (2) people are required to install or relocate the subsystem. To avoid damage to disk drives, drives should be removed from the enclosure before moving the subsystem.
Handle the system modules by the retention screws, extraction levers, or the modules metal frames/faceplates only. Avoid touching the PCB boards, connector pins, and sol- dered surfaces.
Airflow considerations: The subsystem requires an airflow clearance especially on the front and rear. For proper ventilation, a minimum of 2.5cm is required between the front of the enclosure and rack cover; a minimum of 5cm is required between the enclosure and end of the rack.
None of the covers or replaceable modules should be removed in order to maintain com- pliance with safety, emission, or thermal requirements.
Always secure every enclosure module by its retaining screws or make sure it is held in place by its latches.
Always make sure the subsystem has a safe electrical earth connection via power cords or chassis ground by the rack cabinet.
Be sure that the rack cabinet in which the subsystem chassis is to be installed provides sufficient ventilation channels and airflow circulation around the subsystem.
Provide a soft, clean surface to place your enclosure on before working on it. Servicing the enclosure on a rough surface may damage the finish of the chassis.
If it is necessary to transport the subsystem, repackage all disk drives separately. If using the original package material, all other modules can stay within the enclosure.
3.2.2 |
|
| The subsystem contains |
| improper handling and electrostatic discharge (ESD). To prevent ESD damage to any of the |
| components, follow these precautions before touching or handling them: |
| • Discharge the static electricity from your body by wearing an |
| touching a grounded metal surface. |
| • Avoid carpets, plastic, vinyl, and styrofoam in your work area. |
| • Handle all components by holding their edges or metal frame. Avoid touching PCB boards |
| and connector pins. |
3.2.3 | BBU Warnings and Precautions |
| The BBU module sustains cache memory in the event of a power failure or in the unlikely event |
| if both PSUs have failed. Having the protection to cached data by a BBU is highly recom- |
| mended. The BBU provides additional data security and helps minimize the chance of data |
loss during power outage.
• Replace the BBU once it shows symptoms failing to hold the charge. Although the life expectancy of a BBU is determined by the times it has been charged or discharged, a BBU can approximately last for one year. If the battery recharge time is obviously longer than the suggested 12 hours, or if the fault LED is lit, replace the battery.
F.01U.027.797 V2 2008.08 | Bosch Security Systems |
