CY7C1441AV33
CY7C1443AV33,CY7C1447AV33
Document #: 38-05357 Rev. *G Page 20 of 31
Capacitance
Parameter[17] Description Test Conditions 100 TQFP
Max. 165 FBGA
Max. 209 FBGA
Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
6.5 7 5 pF
CCLK Clock Input Capacitance 3 7 5 pF
CIO Input/Output Capacitance 5.5 6 7 pF
Thermal Resistance
Parameter[17] Description Test Conditions 100 TQFP
Package 165 FBGA
Package 209 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
25.21 20.8 25.31 °C/W
ΘJC Thermal Resistance
(Junction to Case) 2.28 3.2 4.48 °C/W
Figure 2. AC Test Loads and Waveforms
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
3.3V IO Test Load
2.5V IO Test Load
Note
17.Tested initially and after any design or process change that may affect these parameters
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