Emerson MVME55006E manual Component Temperature Measurement, Preparation

Component Temperature Measurement Thermal Validation

Figure B-2 Thermally Significant Components—Primary Side

PMC 2

PMC 1

ABT/RST GigE 10/100 CPU BFL

ENET 1 ENET 2 COM1

J2

J1

J5

U1

		J18		U29	J27		J8
U7		U19	U28		U30
U6					J21	J22
U5	U16	U25
U4								J102 - J110
XU2		XU1						1
							P1
				J23		J24
			J102 - J110					3
	S4	S3
U15		U18	U27
		U23
	U17
U14		U129			J11		J3	J32
	P4						J6 / J100
							J99	1
							J98
U13	U12						J34
						J12	J97
							J101 / J7
	U11							3
U3		U22
							J33
				J13		J14
	U10
U2
			U26				J32
U9		U20
			U126
U8		U125
S2			S5
S1
	U123						P2
		U24						J28
					U31			1
	U124
								3
			J4				J28

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B.3 Component Temperature Measurement

The following sections outline general temperature measurement methods. For the specific types of measurements required for thermal evaluation of this board, see Table B-1.

B.3.1 Preparation

We recommend 40 AWG (American wire gauge) thermocouples for all thermal measurements. Larger gauge thermocouples can wick heat away from the components and disturb air flowing past the board.

Allow the board to reach thermal equilibrium before taking measurements. Most circuit boards will reach thermal equilibrium within 30 minutes. After the warm up period, monitor a small number of components over time to assure that equilibrium has been reached.

MVME55006E Single-Board Computer Installation and Use (6806800A37D) 101