Emerson instruction manual ROC827 with One Expanded Backplane

ROC827 Instruction Manual

Figure 1-2 shows a typical expanded backplane (EXP) populated with a full complement of six I/O modules. Each EXP is composed of the same plastic housing as the ROC827, contains six I/O slots, and has a powered backplane that easily attaches to the ROC827 and other EXPs.

Figure 1-2. ROC827 with One Expanded Backplane

The ROC827 and EXPs support nine types of Input/Output (I/O) modules, which can satisfy a wide variety of field I/O requirements (refer to Chapter 4, Input/Output Modules). I/O modules include:

ƒAnalog Inputs (AI).

ƒAnalog Outputs (AO).

ƒDiscrete Inputs (DI).

ƒDiscrete Outputs (DO).

ƒDigital Relay Outputs (DOR).

ƒHART Inputs/Outputs.

ƒPulse Inputs (PI) – High/Low Speed.

ƒResistance Temperature Detector Inputs (RTD).

ƒJ and K Type Thermocouple (T/C) Inputs.

Issued Mar-06 General Information 1-4