Emerson ROC827 instruction manual I/O Module Overview, Issued Mar-06 Input/Output Modules

ROC827 Instruction Manual

Chapter 4 – Input/Output Modules

This chapter describes the Input/Output (I/O) modules used with the ROC827 and expandable backplanes and contains information on installing, wiring, and removing the I/O modules.

In This Chapter

4.1	I/O Module Overview	4-1
4.2	Installation	4-3
	4.2.1 Installing an I/O Module	4-4
	4.2.2 Removing an I/O Module	4-5
	4.2.3 Wiring I/O Modules	4-6
4.3	Analog Input Modules	4-6
4.4	Analog Output Modules	4-8
4.5	Discrete Input Modules	4-9
4.6	Discrete Output Modules	4-10
4.7	Discrete Output Relay Modules	4-11
4.8	Pulse Input Modules	4-12
4.9	RTD Input Modules	4-14
	4.9.1 Connecting the RTD Wiring	4-15
4.10	J and K Type Thermocouple Input Modules	4-16
4.11	Related Specification Sheets	4-21

4.1I/O Module Overview

The I/O modules typically consist of a terminal block for field wiring and connectors to the backplane. The ROC827 base unit supports up to three I/O modules. Each expandable backplane (EXP) can accommodate up to six I/O modules, and a fully configured ROC827 can handle up to 27 I/O modules (three on the base unit and six modules on each of up to four expandable backplanes). Each I/O module electrically connects to field wiring by a removable terminal block. Refer to Figures 4-1 and 4-2.

Note: Figure 4-2 represents a ROC827 with one EXP.

Issued Mar-06 Input/Output Modules 4-1