(4)Separate optical sections

The optical head section is separated in such a way that the fixed optics section is separated from the moving optics section to minimize seek time and positioning error. (See Subsection 1.2.4 for the fixed optical section.) This reduces the weight of the moving parts.

The fixed optics section consists of the laser diodes, collimator lens, and optical detector.

The fixed optics section includes a laser diode for recording and playback, and transmits one laser beam to the head actuator.

(5)Panel

The central part of the panel is hollowed out deeply to provide pushing finger space for inserting the cartridge, thereby facilitating the insertion.

The panel is also simply designed by making the eject button and LED light emitting part integral with each other.

1.2.4Control circuit section

Figure 1.4 is the block diagram of the control circuit section.

ATAPI I/F

Main control

MPU

ODC

DSP

User Logic

LSI i/f

F-ROM

D-RAM

Drive

Read Amp

Power Amp

Filter

Sensor

Motor Driver

DE

Head

Laser Diode

Photo Diode

APC Amp

LPC Amp

Head Amp

Actuator

Focus Act.

Track Act.

Spindle Motor

Temperature Sensor

Bias Coil

Eject Motor

Cartridge Sensor

Figure 1.4 Control circuit section block diagram

1 - 8

C156-E142-02EN

Page 29
Image 29
Fujitsu MCE3130AP, MCF3064AP, MCE3064AP manual Control circuit section, Atapi I/F, Mpu Odc Dsp, Rom Ram

MCE3130AP, MCE3064AP, MCF3064AP specifications

The Fujitsu MCF3064AP, MCE3064AP, and MCE3130AP are notable models in the realm of semiconductor technology and memory solutions. Each of these integrated circuits brings distinct features, technologies, and capabilities to various applications in modern electronics.

Starting with the MCF3064AP, this dynamic RAM device is built to provide efficient memory management and performance. It has a capacity of 64 kilobits, making it an ideal solution for early computer systems, embedded applications, and industrial electronics. The key characteristic of this chip is its fast access time, which facilitates quicker data retrieval and enhances overall system performance. The MCF3064AP supports a standard 16-pin DIP package, making it compatible with a variety of circuit designs, simplifying integration into existing systems.

On the other hand, the MCE3064AP also offers a 64 kilobit memory capacity but comes with enhanced features aimed at improving power efficiency and performance stability. This version is well suited for battery-operated devices where power consumption is a critical consideration. With its advanced static RAM architecture, the MCE3064AP ensures lower power usage while maintaining high-speed performance. Its operational characteristics allow it to function seamlessly over various temperature ranges, making it suitable for diverse application environments.

Lastly, the MCE3130AP distinguishes itself by offering an increased memory capacity of 128 kilobits. This model is tailored for applications that require higher data storage, such as telecommunications and networking equipment. The MCE3130AP employs sophisticated memory technology that not only optimizes data transfer rates but also enhances durability and reliability. It features an optimized pin configuration allowing easy integration into modern systems, along with advanced error detection and correction functionalities, ensuring data integrity across critical applications.

Collectively, the Fujitsu MCF3064AP, MCE3064AP, and MCE3130AP exemplify innovations in memory technology, catering to a wide range of electronic applications. Their distinctive features, varying capacities, and high-performance characteristics make them essential components in the advancement of computing systems and electronic devices. As technology continues to evolve, these semiconductor solutions from Fujitsu pave the way for more efficient, reliable, and powerful electronic systems.