3.1.2Temperature requirements and measuring method

Table 3.1 shows the temperature requirement at each measurement point shown in Figure 3.1.

Table 3.1 Temperature requirements at measurement points

Measurement point

Maximum surface temperature

 

 

Cartridge inside

55°C (*)

 

 

IC (controller) surface

95 °C

 

 

IC (read amp.) surface

85 °C

 

 

Note: * 60°C for the optical disk cartridge (1.3 GB excluded) manufactured by Fujitsu.

Following procedure is for temperature measurement of inside cartridge.

1)Make a hole for the thermocouple as shown in Figure 3.1.

2)Disassemble the cartridge disk.

3)Cut off a part of the partition wall for the optical media as shown in Figure 3.1. (Cut off width: 5 to 10 mm)

4)Fix the tip of the thermocouple to the cut portion of partition wall with an adhesive agent.

5)Pass the thermocouple through the hole at the cartridge case and assemble the cartridge disk. When there is a gap between the hole and the thermocouple, fill the gap with the adhesive agent.

Note:

The surface of the cartridge shown in Figure 3.1 has been cut away to make the elements inside the case clearly visible. In reality the surface is not cut away.

If the external environment temperature is higher than the specified value, the device will automatically take an interval to respond to command, and then take protective action to respond to the temperature increase.

3.1.3Air flow

It is recommended that this optical disk drive be installed in a fanless cabinet. However, if the power supply is incorporated into the same cabinet, it is necessary that it satisfy the “Temperature Conditions” in 3.1.2 and that the air flow rate being drawn in by the device) at the cartridge loading slot be 0.02 m3/min, 0.3 m/s or lower. Furthermore, if there is a system fan in a system where this drive is being installed, the same conditions must be met.

C156-E142-02EN

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Fujitsu MCE3064AP Temperature requirements and measuring method, Temperature requirements at measurement points, Air flow
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MCE3130AP, MCE3064AP, MCF3064AP specifications

The Fujitsu MCF3064AP, MCE3064AP, and MCE3130AP are notable models in the realm of semiconductor technology and memory solutions. Each of these integrated circuits brings distinct features, technologies, and capabilities to various applications in modern electronics.

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Collectively, the Fujitsu MCF3064AP, MCE3064AP, and MCE3130AP exemplify innovations in memory technology, catering to a wide range of electronic applications. Their distinctive features, varying capacities, and high-performance characteristics make them essential components in the advancement of computing systems and electronic devices. As technology continues to evolve, these semiconductor solutions from Fujitsu pave the way for more efficient, reliable, and powerful electronic systems.
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