3.2.4Notes on mounting

(1)Mounting frame structure and clearance

a)For vibration resistance and heat dissipation, this optical disk drive uses an embossed structure as shown in Figure 3.6, as well as a frame which has a construction similar to other frames which perform the same function.

b)As shown in Figure 3.6, the inward projection of the mounting screw from the outer surface of the drive frame must not exceed 3 mm.

c)The clearance between the external surface of the drive frame and the user's frame structure must be at least 1.5 mm.

d)The clearance between the top and bottom surfaces and the user's frame structure must be at least 1.5 mm.

e)When mounting the optical disk drive, the screw tightening torque should be 0.4 to 0.45Nm (4 to 4.6kgcm).

f)When the optical disk drive (with panel) is mounted in a locker, there should be no deformation of the mounting fittings provided and the optical disk drive's panel should not be deformed. If the drive is used with the panel deformed, ejection of the cartridge will be faulty. Check if the door will close from any position whatever when the optical disk drive is installed.

∃15

or less

∃15 orless

Figure 3.6 Mounting frame structure

C156-E142-02EN

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Fujitsu MCE3064AP, MCF3064AP, MCE3130AP manual Mounting frame structure
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MCE3130AP, MCE3064AP, MCF3064AP specifications

The Fujitsu MCF3064AP, MCE3064AP, and MCE3130AP are notable models in the realm of semiconductor technology and memory solutions. Each of these integrated circuits brings distinct features, technologies, and capabilities to various applications in modern electronics.

Starting with the MCF3064AP, this dynamic RAM device is built to provide efficient memory management and performance. It has a capacity of 64 kilobits, making it an ideal solution for early computer systems, embedded applications, and industrial electronics. The key characteristic of this chip is its fast access time, which facilitates quicker data retrieval and enhances overall system performance. The MCF3064AP supports a standard 16-pin DIP package, making it compatible with a variety of circuit designs, simplifying integration into existing systems.

On the other hand, the MCE3064AP also offers a 64 kilobit memory capacity but comes with enhanced features aimed at improving power efficiency and performance stability. This version is well suited for battery-operated devices where power consumption is a critical consideration. With its advanced static RAM architecture, the MCE3064AP ensures lower power usage while maintaining high-speed performance. Its operational characteristics allow it to function seamlessly over various temperature ranges, making it suitable for diverse application environments.

Lastly, the MCE3130AP distinguishes itself by offering an increased memory capacity of 128 kilobits. This model is tailored for applications that require higher data storage, such as telecommunications and networking equipment. The MCE3130AP employs sophisticated memory technology that not only optimizes data transfer rates but also enhances durability and reliability. It features an optimized pin configuration allowing easy integration into modern systems, along with advanced error detection and correction functionalities, ensuring data integrity across critical applications.

Collectively, the Fujitsu MCF3064AP, MCE3064AP, and MCE3130AP exemplify innovations in memory technology, catering to a wide range of electronic applications. Their distinctive features, varying capacities, and high-performance characteristics make them essential components in the advancement of computing systems and electronic devices. As technology continues to evolve, these semiconductor solutions from Fujitsu pave the way for more efficient, reliable, and powerful electronic systems.
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