3.7Mounting

3.7.1Checks before mounting the drive

Before mounting the optical disk drive in the system cabinet, check whether the jumper settings are set correctly.

3.7.2Mounting procedure

How the drive is mounted depends on the system cabinet structure. Determine the mounting procedure in consideration of the requirements of each system. This section contains the general mounting procedure and check items.

See Section 3.2 for details on mounting drive.

1)Tighten four mounting screws to secure the drive in the system cabinet.

#The drive has ten mounting holes (both sides: 3%2, bottom: 4). Secure the drive using the four mounting holes on both sides or the bottom.

#Use mounting screws whose lengths are 3 mm or less from the external wall of the mounting frame of the drive when they are tightened. (See Figure 3.6)

#When mounting with screws, the screw tightening torque should be 0.4 to 0.45Nm (4 to 4.6kgfcm).

#Be careful not to damage the parts on the PCA when mounting the drive.

2)After securing the drive, make sure that the drive does not touch the chassis of the system cabinet. There must be at least 1.5 mm clearance between the drive and chassis. (See Figure 3.6)

3.8Cable Connections

Use the following cables to connect the drive to the system. See Subsection 3.4.2 for details on the connector positions and cable requirements.

# Power supply cable

# AT interface cable

# DC ground cable (if required)

The general procedure for cable connection and notes on connecting cables are given below. Pay attention to the insertion direction of each cable connector.

1)Make sure that the system power is off.

2)Do not connect or disconnect any cable when the power is on.

1)Connect the DC ground cable (only if required to decrease ground noise).

2)Connect the power cables.

3 - 20

C156-E142-02EN

Page 66
Image 66
Fujitsu MCF3064AP, MCE3064AP, MCE3130AP manual Mounting Checks before mounting the drive, Mounting procedure

MCE3130AP, MCE3064AP, MCF3064AP specifications

The Fujitsu MCF3064AP, MCE3064AP, and MCE3130AP are notable models in the realm of semiconductor technology and memory solutions. Each of these integrated circuits brings distinct features, technologies, and capabilities to various applications in modern electronics.

Starting with the MCF3064AP, this dynamic RAM device is built to provide efficient memory management and performance. It has a capacity of 64 kilobits, making it an ideal solution for early computer systems, embedded applications, and industrial electronics. The key characteristic of this chip is its fast access time, which facilitates quicker data retrieval and enhances overall system performance. The MCF3064AP supports a standard 16-pin DIP package, making it compatible with a variety of circuit designs, simplifying integration into existing systems.

On the other hand, the MCE3064AP also offers a 64 kilobit memory capacity but comes with enhanced features aimed at improving power efficiency and performance stability. This version is well suited for battery-operated devices where power consumption is a critical consideration. With its advanced static RAM architecture, the MCE3064AP ensures lower power usage while maintaining high-speed performance. Its operational characteristics allow it to function seamlessly over various temperature ranges, making it suitable for diverse application environments.

Lastly, the MCE3130AP distinguishes itself by offering an increased memory capacity of 128 kilobits. This model is tailored for applications that require higher data storage, such as telecommunications and networking equipment. The MCE3130AP employs sophisticated memory technology that not only optimizes data transfer rates but also enhances durability and reliability. It features an optimized pin configuration allowing easy integration into modern systems, along with advanced error detection and correction functionalities, ensuring data integrity across critical applications.

Collectively, the Fujitsu MCF3064AP, MCE3064AP, and MCE3130AP exemplify innovations in memory technology, catering to a wide range of electronic applications. Their distinctive features, varying capacities, and high-performance characteristics make them essential components in the advancement of computing systems and electronic devices. As technology continues to evolve, these semiconductor solutions from Fujitsu pave the way for more efficient, reliable, and powerful electronic systems.