Manuals / Fujitsu / Computer Equipment / Computer Drive

Fujitsu MHY2080BH, MHY2160BH, MHY2200BH, MHY2250BH, MHY2100BH, MHY2120BH, MHY2060BH Maintenance levels

Models: MHY2120BH MHY2200BH MHY2100BH MHY2160BH MHY2040BH MHY2060BH MHY2080BH MHY2250BH

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7.1 Maintenance

d.Packaging

a)Place the device in an antistatic vinyl bag along with a desiccant (silica gel).

b)It is recommended that you use the shock absorption cushion material and packaging that contained the device when it was delivered by Fujitsu.

If the same packaging material cannot be used, use a shock absorbent box that will transmit shocks directly to the device. When using this type of box, adequately protect the PCA surface and interface connector section.

c)Place a label showing which side is up and clearly stating the notes on handling on the outside of the packaging.

e.Delivery

a)As a rule, deliver as it is packaged and keep the up side up.

b)If delivering a single drive after it is unpacked, take it only a short distance. Also, use shock absorbent material to protect it against shock and vibration. Deliver an unpacked device in either of the allowable packed positions.

Refer to Section 3.2.

f.Storage

a)Store in dampproof packaging.

b)Take care that the environmental requirements satisfy the non-operating environmental specifications described in Section 1.4.

c)To prevent condensation, do not subject the device to sudden changes of temperature.

7.1.3 Maintenance levels

Because of its compact size and special repair requirements, it is recommended that the whole disk drive be replaced. This section describes maintenance on two levels.

(1) Field maintenance (disk drive replacement)

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Replacement at the user site.

Disk drive replacement requires ordinary tools.

Usually, the user, retailer, seller, or OEM trader will replace the drive.

(2) Factory maintenance (parts replacement)

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Only Fujitsu can perform maintenance at this level.

This includes maintenance training and assisting other OEM traders. The OEM trader usually assists the retailer and seller.

Use the factory level tools and test equipment. This includes recommended spare parts and repairing or replacing various parts.

C141-E262

7-5

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Fujitsu MHY2080BH, MHY2160BH, MHY2200BH, MHY2250BH, MHY2100BH, MHY2120BH, MHY2060BH, MHY2040BH manual Maintenance levels

Contents

Disk Drives PRODUCT/MAINTENANCE Manual Handling of This Manual For Safe Operation Revision History This page is intentionally left blank Acronyms and Abbreviations Conventions for Alert MessagesOperating Environment Overview of Manual Preface Liability Exception Conventions Hot Plug Static, Damage Important Alert ItemsImportant Alert Messages Damage or Device damage Device damageData corruption Manual Organization Disk Drives PRODUCT/MAINTENANCE Manual This page is intentionally left blank Contents Theory of Device Operation Installation Conditions Interface Contents 100 Operations Maintenance and Diagnosis Glossary GL-1 Acronyms and Abbreviations AB-1 Index IN-1 Figures Illustrations Response to power-on when the device is powered on Tables Surface temperature measurement points and standard values 105 This page is intentionally left blank Device Overview Adaptability FeaturesFunctions and performance Error correction and retry by ECC Wide temperature rangeLow noise and vibration High resistance against shock Specifications summary Device SpecificationsSpecifications 1/2 Self-diagnosis Model and product number Specifications 2/2 Examples of model names and product numbers Input Voltage Power RequirementsRipple Slope of an input voltage at rise Permissible level − 0.2 Current and power dissipation Current Requirements and Power Dissipation Environmental specifications Environmental SpecificationsCurrent fluctuation Typ. at +5 V when power is turned on Shock and vibration specification Acoustic noise specificationAcoustic Noise Shock and Vibration Data assurance in the event of power failure Service lifeReliability Mean time between failures Mtbf Unrecoverable read error Error RatePositioning error Media Defects Recommended power-off sequence Advanced Power Management APM Advanced Power Management Device-initiated interface power management Dipm Interface Power Management IPMHost-initiated interface power management Hipm Interface power management This page is intentionally left blank Device Configuration Disk Device ConfigurationHead Spindle motor Drive connection System ConfigurationSata interface This page is intentionally left blank Installation Conditions Dimensions Dimensions Integration Guidance C141-E144 MountingOrientation Frame PCA Limitation of mounting Location of breather Ambient temperature Handling cautions Service area Hios ESDSumitomo 3M Connections with Host System Device connector Connector specifications for host system Signal segment and power supply segment Sata interface cable connection This page is intentionally left blank Theory of Device Operation Subassemblies OutlineDisk Spindle Air filter Circuit ConfigurationServo circuit Spindle motor driver circuit Power supply configuration PCA Power-on Sequence Power-onStart Self-calibration Self-calibration contents Execution timing of self-calibration Command processing during self-calibration Read/write preamplifier PreAMP Read/write CircuitWrite circuit Write precompensation Programmable filter circuit Read circuitAGC circuit FIR circuit Digital PLL circuitD converter circuit Viterbi detection circuit Servo control circuit Servo Control Microprocessor unit MPU Power amplifierServo burst capture circuit A converter DAC Data-surface servo format Physical sector servo configuration on disk surface Servo frame format Operation to move the head to the reference cylinder Actuator motor controlSeek operation Track following operation Acceleration mode Start modeStable rotation mode Spindle motor control This page is intentionally left blank Interface Physical Interface Interface signals 5VDC/GND Comreset / CominitComwake Out of band signaling Signal interface regulation Primitives descriptions Electrical specifications Connector pinouts Connector pinouts Driving Activity LED 5 P11 functionStaggered Spin-up Example of the circuit for driving Activity LED Requirements for P11 as an output pin Hot Plug Logical Interface Conceptual diagram of communication layers Physical layer Communication layersLink layer Transport layer Shadow Block Register Outline of the Shadow Block Register FIS types Outline of the frame information structure FIS Register Host to Device FIS layout Register Host to Device DMA Active Device to Host Register Device to Host TAG DMA Setup Device to Host or Host to Device Bidirectional Bist combinations Bist Active Bidirectional Data Host to Device or Device to Host Bidirectional PIO Setup Device to Host Interface 11 Set Device Bits FIS Set Device Bits Device to Host Shadow block registers Error FieldUNC Sfrr Sector Count Field exp Features Field expSector Number Field exp Cylinder Low Field exp Device/Head Field Cylinder High Field expHS3 HS2 HS1 HS0 DSC DRQ ERR Status fieldBSY Bit 2 Software Reset Srst Command FieldDevice Control Field EStatus Field Command code and parameters 1/3 Host CommandsCommand code and parameters Command code and parameters 2/3 Command code and parameters 3/3 Command descriptions Recalibrate X 10 to X 1F Error reporting conditions Read Sectors X 20 or X LBA LBA LSB Write Sectors X 30 or X 00 *1 Error information Write Verify X 3C Host Commands Read Verify Sectors X 40 or X Host Commands Seek X 70 to X 7F Diagnostic code Execute Device Diagnostic X Initialize Device Parameters X Download Microcode X Operation of Download Microcode Microcode Standby Immediate X 94 or X E0 Host Commands Unload Feature Unload Immediate Command Standby X 96 or X E2 Idle X 97 or X E3 Host Commands Check Power Mode X 98 or X E5 Sleep X 99 or X E6 Comreset Smart X B0 Features Field values subcommands and functions 1/3 Smart Enable Operations Features Field values subcommands and functions 2/3Smart Read LOG Smart Write LOG Smart Disable Operations Features Field values subcommands and functions 3/3Smart ENABLE/DISABLE Auto OFF-LINE Smart Return Status Key C2h Key 4Fh 1FF 11 Format of guarantee failure threshold value data10 Format of device attribute value data Attribute ID Data format version number Current attribute value Status FlagAttribute value for the worst case so far Raw attribute value 13 Self-test execution status 12 Off-line data collection statusSelf-test execution status 14 Off-line data collection capability Off-line data collection capabilityFailure prediction capability flag 15 Failure prediction capability flag 16 Drive error logging capability Error logging capabilityGuarantee failure threshold Checksum 18 Data format of Smart Summary Error Log 1/2 Smart error logging Command data structure 18 Data format of Smart Summary Error Log 2/2Error data structure Total number of drive errors Smart Self-Test 19 Data format of Smart Comprehensive Error LogStatus 1FC 20 Smart self-test log data formatSelf-test number Self-test index Current LBA under test 21 Selective self-test log data structureTest Span 22 Selective self-test feature flags Feature FlagsSmart Command Transport SCT Current Span under test SCT Command SET 23 SCT command and the functionSCT Status Request SCT Read Data SCT Status Request SN = E0h, FR = D5h SET MAX EXT, DCO 24 Format of SCT Status Response 1/2 24 Format of SCT Status Response 2/2 25 SCT Status code SCT Command SET SN = E0h, FR = D6 27 Write Same 1/2 26 Action code 27 Write Same 2/2 28 Error Recovery Control 29 Feature Control Command 30 SCT Data Table 31 had Temperature SCT Read Data SN = E1h, FR = D5h SCT Write Data SN = E1h, FR = D6h Device Configuration Restore Device Configuration X B1Device Configuration Freeze Device Configuration Identify Device Configuration Freeze Lock Features Field = C1h Device Configuration Restore Features Field = C0h Device Configuration SET Features Field = C3h Device Configuration Identify Features Field = C2h 32 Device Configuration Identify data structure 1/2 32 Device Configuration Identify data structure 2/2 Read Multiple X C4 12 Execution example of Read Multiple command LBA LSB Write Multiple X C5 At command issuance Shadow Block Registers setting contents SET Multiple Mode X C6 Host Commands Read DMA X C8 or X C9 LBA Write DMA X CA or X CB Host Commands Read Buffer X E4 Flush Cache X E7 Write Buffer X E8 Identify Device X EC Identify Device DMA X EE 33 Information to be read by Identify Device command 1/3 33 Information to be read by Identify Device command 2/3 33 Information to be read by Identify Device command 3/3 MHY2100BH MHY2080BH MHY2060BH MHY2040BH MHY2250BH MHY2200BH MHY2160BH MHY2120BHFffffff Command without interrupt supports 1, 2, 4, 8 and 16 sectors Word 63 Multiword DMA transfer mode C141-E262 111 Interface C141-E262 113 Bits 13-0 Same definition as Word Undefined = Read and Write DMA EXT GPL optional commands are Host Commands Download 34 Features field values and settable modes 1/2 SET Features X EF 34 Features field values and settable modes 2/2 Error reporting conditions Data Transfer Mode Advanced Power Management APM Serial ATA Functions Automatic Acoustic Management AAM Write-Read-Verify feature optional 35 Contents of Security SET Password data Error reporting conditions Security Unlock X F2 When the master password is selectedWhen the user password is selected Host Commands Security Erase Prepare X F3 Security Erase Unit X F4 Security Freeze Lock X F5 Error reporting conditions 37 Contents of security password Error reporting conditions Lbalsb Read Native MAX Address X F8 SET MAX Address SET MAX X F9 SET MAX SET Password Features Field = 01h Password information SET MAX Lock Features Field = 02h SET MAX Unlock Features Field = 03h SET MAX Freeze Lock Features Field = 04h Read Sector S EXT X Description Read DMA EXT X Description Read Native MAX Address EXT X Read Multiple EXT X Read LOG EXT X 2F Sector offset 39 Tag field information 38 Data format of Read Log Ext log page 10h 41 Counter Identifier information 40 Data format of Read Log Ext log page 11h FR EXP SCT Status Request SN = E0hSC EXP SCT Read Data SN = E1h, FR = D5 Write Sector S EXT X Description Write DMA EXT X Description SET MAX Address EXT X SET MAX LBA Write Multiple EXT X Write DMA FUA EXT X 3D Write LOG EXT X 3F Error information 160 C141-E262 SCT Command SET SN = E0h SCT Write Data SN = E1h Read Verify Sector S EXT X Write Uncorrectable EXT X 42 Operation mode Read LOG DMA EXT X Description Write LOG DMA EX X Description Read FP DMA Queued X Description Write FP DMA Queued X Write Multiple FUA EXT X CE Flush Cache EXT X EA 43 Command code and parameters 1/2 Error postingCommand Name Sfrw Sfrr DWF 43 Command code and parameters 2/2 Data Command ProtocolExecute Device Diagnostic Initialize Device Parameters Non-data command protocol Host PIO data-in command protocol 14 PIO data-in command protocol PIO data-out command protocol 15 PIO data-out command protocol Read DMA EXT Identfy Device DMA Read LOG DMA EXT DMA data-in command protocol Write DMA EXT FUA EXT Write LOG DMA EXT DMA data-out command protocol Read FP DMA Queued Write FP DMA Queued Native Command Queuing protocol 18 Read FP DMA Queued command protocol 19 Write FP DMA Queued command protocol 20 Power-on sequence Power-on and Comreset 21 Comreset sequence This page is intentionally left blank Operations Response to power-on Reset and Diagnosis Reset and Diagnosis Response to Comreset Response to Comreset Comreset preservation requirements Software settings preservation SET Address MAX EXT Response to a software reset Response to a software reset Power save mode Power SaveActive mode Active idle mode Sleep mode Standby mode Power commands Partial mode Power Save Controlled by Interface Power Management IPMPower save mode of the interface Slumber mode Data buffer structure Read-ahead CacheExample of 8 MB buffer Read Sector S EXT Data that is a target of caching Commands that are targets of cachingCaching operation Invalidating caching-target data Miss-hit Using the read segment buffer Sequential hit Full hit Partial hit Write Cache Command that are targets of cachingCache operation Invalidation of cached data Comreset and software reset response Status report in the event of an errorCashing function when power supply is turned on Enabling and disabling This page is intentionally left blank Maintenance and Diagnosis Rules for maintenance Maintenance Maintenance requirements Data corruption Maintenance levels Disk drive revision number label Disk drive revision number Display of disk drive revision number Test Self-diagnosticsTools and test equipment Test flowchart Disposition for Error Field contents Status Field contents Operation test Diagnostic testOperation Confirmation Troubleshooting disk drive replaced in field Troubleshooting ProcedureTroubleshooting procedure VDC System level and field troubleshooting Troubleshooting at factory Spare Disk Drive Disk Drive Removal Procedure This page is intentionally left blank Glossary Rotational delay Power save modeMaster Device PIO Programmed input-output Status Serial-ATASlave Device This page is intentionally left blank Acronyms and Abbreviations This page is intentionally left blank Caching Index Index Example of model name and product Mode Read Native MAX Address Read/write circuit block diagram Shadow block register, outline Japan Comment Form This page is intentionally left blank C141-E262-01EN Page