NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with UMA memory. Thermal paste is used on the processor (1) and the heat sink section (2) that services it.
NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with discrete memory.
●Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it
●Thermal pads are used on the system board components (5) and the heat sink sections (6) that service them
86 | Chapter 4 Removal and replacement procedures |
