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320028-001 manual
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42 pages, 1.52 Mb
Order Number: 320028-001
Intel® Core™ 2 Duo Mobile
Processors on 45-nm process for
Embedded Applications
Thermal Design Guide
June 2008
Contents
Main
Page
Contents
Figures
Tables
Page
1.0 Introduction
1.1 Design Flow
1.2 Definition of Terms
Figure 1. Thermal Design Process
Table 1. Definition of Terms (Sheet 1 of 2)
1.3 Reference Documents
1.4 Thermal Design Tool Availability
2.0 Package Information
3.0 Thermal Specifications
3.1 Thermal Design Power
3.2 Maximum Allowed Component Temperature
4.0 Mechanical Specifications
4.1 Package Mechanical Requirements
4.1.1 Die Pressure/Load Upper Limit
4.1.2 Die Pressure/Load Lower Limit
4.2 Package Keep Out Zones Requirements
Page
Page
Page
5.0 Thermal Solution Requirements
5.1 Thermal Solution Characterization
JA = JS + SA
TDP
T T
T T
T
WC
35
TIM Device
Page
6.0 Reference Thermal Solutions
6.1 ATCA Reference Thermal Solution
6.2 Keep Out Zone Requirements
6.3 Thermal Performance
6.4 1U+ Reference Heatsink
6.4.1 Keep Out Zone Requirements
6.4.2 Thermal Performance
6.5 Compact PCI Reference Heatsink
1U+ Reference Heatsink Performance
6.5.1 Keep Out Zone Requirements
6.5.2 Thermal Performance
6.6 Heatsink Fastener Assembly
6.7 Thermal Interface Material (TIM)
6.8 Heatsink Orientation
7.0 Thermal Metrology
7.1 Die Temperature Measurements
7.2 Power Simulation Software
7.3 Additional Thermal Features
7.4 Local Ambient Temperature Measurement Guidelines
7.4.1 Active Heatsink Measurements
7.4.2 Passive Heatsink Measurements
Page
Page
8.0 Reliability Guidelines
Appendix A Thermal Solution Component Suppliers
Appendix B Mechanical Drawings
Tab le 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings