Manuals / Brands / Computer Equipment / Computer Hardware / Intel / Computer Equipment / Computer Hardware

Intel 320028-001 6.2 Keep Out Zone Requirements, 6.3 Thermal Performance, 6.4 1U+ Reference Heatsink

1 42

Download 42 pages, 1.52 Mb

Core™ 2 Duo Mobile Processors—Reference Thermal Solutions

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

TDG June 2008

19 Order Number: 320028-001

6.2 Keep Out Zone Requirements

The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B,

“Mechanical Drawings”. Because it extends beyond the footprint of the device, it is critical for the

board designer to allocate space on the board for the heatsink.

6.3 Thermal Performance

The AdvancedTCA reference heatsink is an all copper (C1100) design. The performance of this

heatsink has been tested at flow rates from 10 CFM to 30 CFM. The heatsink is expected to meet the

thermal performance needed when the air flow rate is at least 10 CFM at 40 °C. For an external

ambient of 55°C (ψja = 1.32 °C/W), this heatsink is expected to be suitable for air flow rates around

15 CFM.

6.4 1U+ Reference Heatsink

The 1U reference thermal solution is shown in Figure 8. The maximum heatsink height is constrained

to 27 mm. The heatsink uses the fastener assembly (refer to Section 6.6) to mount to the PCB.

Detailed drawings of this heatsink are provided in Appendix B, “Mechanical Drawings”.

Figure 7. AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate

Contents

Main Page Contents Figures Tables Page 1.0 Introduction 1.1 Design Flow 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) 1.3 Reference Documents 1.4 Thermal Design Tool Availability 2.0 Package Information 3.0 Thermal Specifications 3.1 Thermal Design Power 3.2 Maximum Allowed Component Temperature 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit 4.1.2 Die Pressure/Load Lower Limit 4.2 Package Keep Out Zones Requirements Page Page Page 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization JA = JS + SA TDP T T T T T WC 35 TIM Device Page 6.0 Reference Thermal Solutions 6.1 ATCA Reference Thermal Solution 6.2 Keep Out Zone Requirements 6.3 Thermal Performance 6.4 1U+ Reference Heatsink 6.4.1 Keep Out Zone Requirements 6.4.2 Thermal Performance 6.5 Compact PCI Reference Heatsink 1U+ Reference Heatsink Performance 6.5.1 Keep Out Zone Requirements 6.5.2 Thermal Performance 6.6 Heatsink Fastener Assembly 6.7 Thermal Interface Material (TIM) 6.8 Heatsink Orientation 7.0 Thermal Metrology 7.1 Die Temperature Measurements 7.2 Power Simulation Software 7.3 Additional Thermal Features 7.4 Local Ambient Temperature Measurement Guidelines 7.4.1 Active Heatsink Measurements 7.4.2 Passive Heatsink Measurements Page Page 8.0 Reliability Guidelines Appendix A Thermal Solution Component Suppliers Appendix B Mechanical Drawings Tab le 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings