Intel 320028-001 Appendix B Mechanical Drawings

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008 TDG

Order Number: 320028-001 30

Mechanical Drawings—Core™ 2 Duo Mobile Processors

Appendix B Mechanical Drawings

Tab le 6 lists the mechanical drawings included in this appendix.

Table 6. Mechanical Drawings

Description Figure

AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) Figure 15

AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (She et 2 of 2) Figure 16

AdvancedTCA* Reference Heatsink Assembly Figure17

AdvancedTCA* Reference Heatsink Figure 18

CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) Figure 19

CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2) Figure 20

CompactPCI* Reference Heatsink Assembly Figure 21

CompactPCI* Reference Heatsink Figure 22

1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2) Figure 23

1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2) Figure 24

1U Reference Heatsink Assembly Figure 25

1U Reference Heatsink Figure 26

Contents

Main Page Contents Figures Tables Page 1.0 Introduction 1.1 Design Flow 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) 1.3 Reference Documents 1.4 Thermal Design Tool Availability 2.0 Package Information 3.0 Thermal Specifications 3.1 Thermal Design Power 3.2 Maximum Allowed Component Temperature 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit 4.1.2 Die Pressure/Load Lower Limit 4.2 Package Keep Out Zones Requirements Page Page Page 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization JA = JS + SA TDP T T T T T WC 35 TIM Device Page 6.0 Reference Thermal Solutions 6.1 ATCA Reference Thermal Solution 6.2 Keep Out Zone Requirements 6.3 Thermal Performance 6.4 1U+ Reference Heatsink 6.4.1 Keep Out Zone Requirements 6.4.2 Thermal Performance 6.5 Compact PCI Reference Heatsink 1U+ Reference Heatsink Performance 6.5.1 Keep Out Zone Requirements 6.5.2 Thermal Performance 6.6 Heatsink Fastener Assembly 6.7 Thermal Interface Material (TIM) 6.8 Heatsink Orientation 7.0 Thermal Metrology 7.1 Die Temperature Measurements 7.2 Power Simulation Software 7.3 Additional Thermal Features 7.4 Local Ambient Temperature Measurement Guidelines 7.4.1 Active Heatsink Measurements 7.4.2 Passive Heatsink Measurements Page Page 8.0 Reliability Guidelines Appendix A Thermal Solution Component Suppliers Appendix B Mechanical Drawings Tab le 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings