Intel 320028-001 Appendix A Thermal Solution Component Suppliers

Core™ 2 Duo Mobile Processors—Thermal Solution Component Suppliers

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

TDG June 2008

29 Order Number: 320028-001

Appendix A Thermal Solution Component Suppliers

These vendors and devices are listed by Intel as a convenience to Intel’s general customer base. Intel

does not make any representations or warranties whatsoever regarding quality, reliability,

functionality, or compatibility of these devices. This list and/or these devices may be subject to

change without notice.

Note: The enabled components may not be currently available from all suppliers. Contact the

supplier directly to verify availability.

Table 5. Reference Heatsink

Part Part Number Contact Information

AdvancedTCA* passive heatsink assembly ECC-00177-01-GP Cooler Master*

Wendy Li n

wendy@coolermaster.com

(510)770-8566 ext 211

1U+ passive heatsink assembly ECC-00179-01-GP

cPCI passive heatsink assembly ECC-00178-01-GP

Thermal Interface Material PCM45F

Honeywell*

Paula Knoll

paula.knoll@honeywell.com

(858) 279-2956

Contents

Main Page Contents Figures Tables Page 1.0 Introduction 1.1 Design Flow 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) 1.3 Reference Documents 1.4 Thermal Design Tool Availability 2.0 Package Information 3.0 Thermal Specifications 3.1 Thermal Design Power 3.2 Maximum Allowed Component Temperature 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit 4.1.2 Die Pressure/Load Lower Limit 4.2 Package Keep Out Zones Requirements Page Page Page 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization JA = JS + SA TDP T T T T T WC 35 TIM Device Page 6.0 Reference Thermal Solutions 6.1 ATCA Reference Thermal Solution 6.2 Keep Out Zone Requirements 6.3 Thermal Performance 6.4 1U+ Reference Heatsink 6.4.1 Keep Out Zone Requirements 6.4.2 Thermal Performance 6.5 Compact PCI Reference Heatsink 1U+ Reference Heatsink Performance 6.5.1 Keep Out Zone Requirements 6.5.2 Thermal Performance 6.6 Heatsink Fastener Assembly 6.7 Thermal Interface Material (TIM) 6.8 Heatsink Orientation 7.0 Thermal Metrology 7.1 Die Temperature Measurements 7.2 Power Simulation Software 7.3 Additional Thermal Features 7.4 Local Ambient Temperature Measurement Guidelines 7.4.1 Active Heatsink Measurements 7.4.2 Passive Heatsink Measurements Page Page 8.0 Reliability Guidelines Appendix A Thermal Solution Component Suppliers Appendix B Mechanical Drawings Tab le 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings