Intel 320028-001 8.0 Reliability Guidelines

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008 TDG

Order Number: 320028-001 28

Reliability Guidelines—Core™ 2 Duo Mobile Processors

8.0 Reliability Guidelines

Each motherboard, heatsink, and attach combination may vary the mechanical loading of the

component. The user should carefully evaluate the reliability of the completed assembly prior to use

in high volume. Some general recommendations are shown in Tabl e 4.

Table 4. Reliability Requirements

Test1Requirement Pass/Fail Criteria2

Mechanical Shock 50 g, board level, 11 msec, 3 shocks/axis Visual Check and Electrical

Functional Test

Random Vibration 7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz Visual Check and Electrical

Functional Test

Temp era tur e L ife 85 °C, 2000 hours total, checkpoints at 168, 500,

1000, and 2000 hours Visual Check

Thermal Cycling -5 °C to +70 °C, 500 cycles Visual Check

Humidity 85% relative humidity, 55 °C, 1000 hours Visual Check

Notes:

1. The above tests should be performed on a sample size of at least 12 assemblies from three lots of

material.

2. Additional pass/fail criteria may be added at the discretion of the user.

Contents

Main Page Contents Figures Tables Page 1.0 Introduction 1.1 Design Flow 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) 1.3 Reference Documents 1.4 Thermal Design Tool Availability 2.0 Package Information 3.0 Thermal Specifications 3.1 Thermal Design Power 3.2 Maximum Allowed Component Temperature 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit 4.1.2 Die Pressure/Load Lower Limit 4.2 Package Keep Out Zones Requirements Page Page Page 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization JA = JS + SA TDP T T T T T WC 35 TIM Device Page 6.0 Reference Thermal Solutions 6.1 ATCA Reference Thermal Solution 6.2 Keep Out Zone Requirements 6.3 Thermal Performance 6.4 1U+ Reference Heatsink 6.4.1 Keep Out Zone Requirements 6.4.2 Thermal Performance 6.5 Compact PCI Reference Heatsink 1U+ Reference Heatsink Performance 6.5.1 Keep Out Zone Requirements 6.5.2 Thermal Performance 6.6 Heatsink Fastener Assembly 6.7 Thermal Interface Material (TIM) 6.8 Heatsink Orientation 7.0 Thermal Metrology 7.1 Die Temperature Measurements 7.2 Power Simulation Software 7.3 Additional Thermal Features 7.4 Local Ambient Temperature Measurement Guidelines 7.4.1 Active Heatsink Measurements 7.4.2 Passive Heatsink Measurements Page Page 8.0 Reliability Guidelines Appendix A Thermal Solution Component Suppliers Appendix B Mechanical Drawings Tab le 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings