Core™ 2 Duo Mobile Processors—Contents
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG June 2008
3Order Number: 320028-001
Contents1.0 Introduction ............................................................................................................. 6
1.1 Design Flow ......................................................................... .............................. 6
1.2 Definition of Terms .............................................................................................7
1.3 Reference Documents.......................................................................................... 8
1.4 Thermal Design Tool Availability ........................................................................... 8
2.0 Package Information ................................................................................................9
3.0 Thermal Specifications.............................................................................................10
3.1 Thermal Design Power........................................................................................10
3.2 Maximum Allowed Component Temperature..........................................................10
4.0 Mechanical Specifications ........................................................................................11
4.1 Package Mechanical Requirements.......................................................................11
4.1.1 Die Pressure/Load Upper Limit..................................................................11
4.1.2 Die Pressure/Load Lower Limit..................................................................11
4.2 Package Keep Out Zones Requirements................................................................11
4.3 Board Level Keep Out Zone Requirements.............................................................11
5.0 Thermal Solution Requirements...............................................................................15
5.1 Thermal Solution Characterization........................................................................15
5.1.1 Calculating the Required Thermal Performance for the Intel® Core™2 Duo
processor ..............................................................................................16
6.0 Reference Thermal Solutions ...................................................................................18
6.1 ATCA Reference Thermal Solution........................................................................18
6.2 Keep Out Zone Requirements..............................................................................19
6.3 Thermal Performance.........................................................................................19
6.4 1U+ Reference Heatsink.....................................................................................19
6.4.1 Keep Out Zone Requirements...................................................................20
6.4.2 Thermal Performance..............................................................................20
6.5 Compact PCI Reference Heatsink.........................................................................21
6.5.1 Keep Out Zone Requirements...................................................................22
6.5.2 Thermal Performance..............................................................................22
6.6 Heatsink Fastener Assembly................................................................................22
6.7 Thermal Interface Material (TIM) .........................................................................22
6.8 Heatsink Orientation ..........................................................................................23
7.0 Thermal Metrology...................................................................................................24
7.1 Die Temperature Measurements ..........................................................................24
7.2 Power Simulation Software .................................................................................24
7.3 Additional Thermal Features................................................................................24
7.4 Local Ambient Temperature Measurement Guidelines..............................................24
7.4.1 Active Heatsink Measurements .................................................................25
7.4.2 Passive Heatsink Measurements................................................................25
8.0 Reliability Guidelines ...............................................................................................28
A Thermal Solution Component Suppliers....................................................................29
B Mechanical Drawings ...............................................................................................30