Core™ 2 Duo Mobile Processors—Thermal Solution Requirements
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG June 2008
17 Order Number: 320028-001
It is evident from the above calculations that a reduction in the local ambient temperature can have a
significant effect on the junction-to-ambient thermal resistance requirement. This effect can
contribute to a more reasonable thermal solution including reduced cost, heatsink size, heatsink
weight, or a lower system airflow rate.
Tab le 3 summarizes the thermal budget required to adequately cool the Intel® Core™ 2 Duo Mobile
Processors on 45-nm process. Since the data is based on air data at sea level, a correction factor
would be required to estimate the thermal performance at other altitudes.
Table 3. Required Heatsink Thermal Performance (ΨJA)
CPU Processor SKU TDP
(W) Ψ JA (ºC/W)
at TA = 40 ºC Ψ JA (ºC/W)
at TA = 55 ºC
Intel® Core™ 2 Duo
Mobile Processors on 45-
nm process
Standard Voltage
(Core 2 Duo-6M,
Celeron-2M) 35 1.86 1.42
Low Voltage
(Core 2 Duo -3M) 17 3.82 2.94
Ultra Low Voltage
(Core 2 Duo -2M,
Celeron) 10 6.5 5.0
Notes:
1. TA is defined as the local (internal) ambient temperature measured approximately 1 inch upstream
from the device.