Intel 320028-001

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008 TDG

Order Number: 320028-001 12

Mechanical Specifications—Core™ 2 Duo Mobile Processors

Notes:

1. Dime nsion in millimeters [inches].

Figure 2. Primary Si de Keep Out Zone Requirements— Micro-FCPGA

Contents

Main Page Contents Figures Tables Page 1.0 Introduction 1.1 Design Flow 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) 1.3 Reference Documents 1.4 Thermal Design Tool Availability 2.0 Package Information 3.0 Thermal Specifications 3.1 Thermal Design Power 3.2 Maximum Allowed Component Temperature 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit 4.1.2 Die Pressure/Load Lower Limit 4.2 Package Keep Out Zones Requirements Page Page Page 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization JA = JS + SA TDP T T T T T WC 35 TIM Device Page 6.0 Reference Thermal Solutions 6.1 ATCA Reference Thermal Solution 6.2 Keep Out Zone Requirements 6.3 Thermal Performance 6.4 1U+ Reference Heatsink 6.4.1 Keep Out Zone Requirements 6.4.2 Thermal Performance 6.5 Compact PCI Reference Heatsink 1U+ Reference Heatsink Performance 6.5.1 Keep Out Zone Requirements 6.5.2 Thermal Performance 6.6 Heatsink Fastener Assembly 6.7 Thermal Interface Material (TIM) 6.8 Heatsink Orientation 7.0 Thermal Metrology 7.1 Die Temperature Measurements 7.2 Power Simulation Software 7.3 Additional Thermal Features 7.4 Local Ambient Temperature Measurement Guidelines 7.4.1 Active Heatsink Measurements 7.4.2 Passive Heatsink Measurements Page Page 8.0 Reliability Guidelines Appendix A Thermal Solution Component Suppliers Appendix B Mechanical Drawings Tab le 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings