Intel 320028-001 1.2 Definition of Terms

Core™ 2 Duo Mobile Processors—Introduction
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG June 2008
7Order Number: 320028-001
1.2 Definition of Terms
Figure 1. Thermal Design Process
Table 1. Definition of Terms (Sheet 1 of 2)
Term Definition
FCPGA Flip Chip Pin Grid Array. A pin grid array packaging technology where the die is
exposed on the package substrate.
FCBGA Flip Chip Ball Grid Array. A ball grid array packaging technology where the die is
exposed on the package substrate.
TJUNCTION-MAX Maximum allowed component (junction) temperature. Also referred to as TJ-MAX
TDP Thermal Design Power. Thermal solutions should be designed to dissipate this
target power level.
TLA Local ambient temperature. This is the temperature measured inside the chassis,
approximately 1 inch upstream of a component heatsink. Also referred to as TA.
ΨJA
Junction-to-ambient thermal characterization parameter. A measure of heatsink
thermal performance using the total package power. Defined as (T JUNCTION – TLA) /
Total Package Powe r
ΨTIM
Thermal interface material thermal characterization parameter. A measure of
thermal interface material performance using total package power. Defined as (T
CASE – T JUNCTION)/ Total Package Power. Also referred to as ΨJS.
ΨSA
Sink-to-ambient thermal characterization parameter. A measure of heatsink
thermal performance using total package power. Defined as (T SINK – T JUNCTION)/
Total Package Powe r.
°C Degrees in Celsius
CFM Volumetric airflow rate in cubic feet per minute
in. Inches
LFM Airflow velocity in linear feet per minute
PCB Printed circuit board
TSINK Heatsink temperature measured on the underside of the heatsink base.
• Package Level Thermal Models
• Thermal Model User’s Guide
Step 1: Thermal Simulation
• Reference Heatsinks
• Reference Mounting Hardware
• Vendor Contacts
Step 2: Heatsink Design
and Selection
Step 3: Thermal Validation
• Thermal Testing Software
• Thermal Test Vehicle
• User Guides