Intel 320028-001 manual Definition of Terms Sheet 1

Core™ 2 Duo Mobile Processors—Introduction

Figure 1. Thermal Design Process

Step 1: Thermal Simulation
•	Package Level Thermal Models	Step 2: Heatsink Design
•	Thermal Model User’s Guide
		and Selection
		•	Reference Heatsinks
		•	Reference Mounting Hardware	Step 3: Thermal Validation
		•	Vendor Contacts
				•	Thermal Testing Software
				•	Thermal Test Vehicle
				•	User Guides

1.2Definition of Terms

Table 1.	Definition of Terms (Sheet 1 of 2)
	Term	Definition
	FCPGA	Flip Chip Pin Grid Array. A pin grid array packaging technology where the die is
		exposed on the package substrate.
	FCBGA	Flip Chip Ball Grid Array. A ball grid array packaging technology where the die is
		exposed on the package substrate.
	TJUNCTION-MAX	Maximum allowed component (junction) temperature. Also referred to as TJ-MAX
	TDP	Thermal Design Power. Thermal solutions should be designed to dissipate this
		target power level.
	TLA	Local ambient temperature. This is the temperature measured inside the chassis,
		approximately 1 inch upstream of a component heatsink. Also referred to as TA.
		Junction-to-ambient thermal characterization parameter. A measure of heatsink
	ΨJA	thermal performance using the total package power. Defined as (T JUNCTION – TLA) /
		Total Package Power
		Thermal interface material thermal characterization parameter. A measure of
	ΨTIM	thermal interface material performance using total package power. Defined as (T
		CASE – T JUNCTION)/ Total Package Power. Also referred to as ΨJS.
		Sink-to-ambient thermal characterization parameter. A measure of heatsink
	ΨSA	thermal performance using total package power. Defined as (T SINK – T JUNCTION)/
		Total Package Power.
	°C	Degrees in Celsius
	CFM	Volumetric airflow rate in cubic feet per minute
	in.	Inches
	LFM	Airflow velocity in linear feet per minute
	PCB	Printed circuit board
	TSINK	Heatsink temperature measured on the underside of the heatsink base.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG	June 2008
7	Order Number: 320028-001