Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008 TDG
Order Number: 320028-001 4
Figures—Core™ 2 Duo Mobile Processors
Figures1 Thermal Design Process..............................................................................................7
2 Primary Side Keep Out Zone Requirements— Micro-FCPGA............................................ 12
3 Primary Side Keep Out Zone Requirements— Micro-FCBGA............................................13
4 Secondary Side Keep Out Zone Requirements..............................................................14
5 Processor Thermal Characterization Parameter Relationships ......................................... 16
6 AdvancedTCA* Reference Heatsink Assembly...............................................................18
7 AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate ...................... 19
8 1U Reference Heatsink Assembly ...............................................................................20
9 1U Heatsink Thermal Performance vs. Volumetric Airflow Rate .......................................21
10 CompactPCI Reference Heatsink Assembly ..................................................................21
11 cPCI Reference Heatsink Thermal Performance vs. Volumetric Flow Rate .........................22
12 Heatsink Orientation Relative to Airflow Direction .........................................................23
13 Measuring TLA with an Active Heatsink .......................................................................26
14 Measuring TLA with a Passive Heatsink .......................................................................27
15 AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) ........ 31
16 AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2) ........ 32
17 AdvancedTCA* Reference Heatsink Assembly...............................................................33
18 AdvancedTCA* Reference Heatsink.............................................................................34
19 CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2).......... 35
20 CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2).......... 36
21 CompactPCI* Reference Heatsink Assembly.................................................................37
22 CompactPCI* Reference Heatsink...............................................................................38
23 1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2).................................39
24 1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2).................................40
25 1U Reference Heatsink Assembly ...............................................................................41
26 1U Reference Heatsink..............................................................................................42
Tables1 Definition of Terms.....................................................................................................7
2 Thermal Specifications for the Intel® Core™2 Duo processor..........................................10
3 Required Heatsink Thermal Performance (ΨJA).............................................................17
4 Reliability Requirements............................................................................................28
5 Reference Heatsink ..................................................................................................29
6 Mechanical Drawings................................................................................................30