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Intel 320028-001 6.4.1 Keep Out Zone Requirements, 6.4.2 Thermal Performance

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Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008 TDG

Order Number: 320028-001 20

Reference Thermal Solutions—Core™ 2 Duo Mobile Processors

6.4.1 Keep Out Zone Requirements

The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B,

“Mechanical Drawings”. Because it extends beyond the footprint of the device, it is critical for board

designers to allocate space for the heatsink.

6.4.2 Thermal Performance

The 1U reference heatsink employs a thick copper (C1100) base with aluminum (Al 1050) stamped

fins, soldered to the base. The heatsink has been tested at flow rates from 10 CFM to 25 CFM. For a

40 °C external ambient and 35 W TDP, the heatsink is expected to meet the thermal performance

needed when the air flow rate is greater than 10 CFM. If the external ambient is 55 °C, this heatsink

will be suitable if the air flow rate is approximately 12 CFM or greater.

Figure 8. 1U Reference Heatsink Assembly

Contents

Main Page Contents Figures Tables Page 1.0 Introduction 1.1 Design Flow 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) 1.3 Reference Documents 1.4 Thermal Design Tool Availability 2.0 Package Information 3.0 Thermal Specifications 3.1 Thermal Design Power 3.2 Maximum Allowed Component Temperature 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit 4.1.2 Die Pressure/Load Lower Limit 4.2 Package Keep Out Zones Requirements Page Page Page 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization JA = JS + SA TDP T T T T T WC 35 TIM Device Page 6.0 Reference Thermal Solutions 6.1 ATCA Reference Thermal Solution 6.2 Keep Out Zone Requirements 6.3 Thermal Performance 6.4 1U+ Reference Heatsink 6.4.1 Keep Out Zone Requirements 6.4.2 Thermal Performance 6.5 Compact PCI Reference Heatsink 1U+ Reference Heatsink Performance 6.5.1 Keep Out Zone Requirements 6.5.2 Thermal Performance 6.6 Heatsink Fastener Assembly 6.7 Thermal Interface Material (TIM) 6.8 Heatsink Orientation 7.0 Thermal Metrology 7.1 Die Temperature Measurements 7.2 Power Simulation Software 7.3 Additional Thermal Features 7.4 Local Ambient Temperature Measurement Guidelines 7.4.1 Active Heatsink Measurements 7.4.2 Passive Heatsink Measurements Page Page 8.0 Reliability Guidelines Appendix A Thermal Solution Component Suppliers Appendix B Mechanical Drawings Tab le 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings