Core™ 2 Duo Mobile Processors—Thermal Solution Requirements

5.0Thermal Solution Requirements

5.1Thermal Solution Characterization

The thermal characterization parameter, Ψ (“psi”), is used to characterize thermal solution performance, as well as compare thermal solutions in identical situations (i.e., heating source, local ambient conditions, etc.). It is defined by the following equation:

Equation 1. Junction-to-Local Ambient Thermal Characterization Parameter (ΨJA)

Ψ = TJ − TA JA TDP

ΨJA = Junction-to-local ambient thermal characterization parameter (°C/W) TJUNCTION MAX = Maximum allowed device temperature (°C)

TA = Local ambient temperature near the device (°C) (see Section 7.0, “Thermal Metrology” for measurement guidelines)

TDP = Thermal Design Power (W)

The thermal characterization parameter assumes that all package power dissipation is through the thermal solution (heatsink), and is equal to TDP. A small percentage of the die power (< 5%) is dissipated through the package/socket/motherboard stack to the environment, and should not be considered to be a means of thermal control.

The junction-to-local ambient thermal characterization parameter, ΨJA, is comprised of ΨJS, which includes the thermal interface material thermal characterization parameter, and of ΨSA, the sink-to- local ambient thermal characterization parameter:

Equation 2. Junction-to-Local Ambient Thermal Characterization Parameter

ΨJA = ΨJS + ΨSA

Where:

ΨJS = Thermal characterization parameter from junction-to-sink, this also includes thermal resistance of the thermal interface material (ΨTIM) (°C/W).

ΨSA = Thermal characterization parameter from sink-to-local ambient (°C/W)

ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. ΨSA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 5 illustrates the combination of the different thermal characterization parameters.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

 

TDG

June 2008

15

Order Number: 320028-001

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Intel 320028-001 manual Thermal Solution Requirements, Thermal Solution Characterization
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320028-001 specifications

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