Core™ 2 Duo Mobile Processors—Thermal Solution Requirements
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG June 2008
15 Order Number: 320028-001
5.0 Thermal Solution Requirements

5.1 Thermal Solution Characterization

The thermal characterization parameter, Ψ (“psi”), is used to characterize thermal solution
performance, as well as compare thermal solutions in identical situations (i.e., heating source, local
ambient conditions, etc.). It is defined by the following equation:
ΨJA = Junction-to-local ambient thermal characterization parameter (°C/W)
TJUNCTION MAX = Maximum allowed device temperature (°C)
TA = Local ambient temperature near the device (°C) (see Section 7.0, “Thermal Metrology” for
measurement guidelines)
TDP = Thermal Design Power (W)
The thermal characterization parameter assumes that all package power dissipation is through the
thermal solution (heatsink), and is equal to TDP. A small percentage of the die power (< 5%) is
dissipated through the package/socket/motherboard stack to the environment, and should not be
considered to be a means of thermal control.
The junction-to-local ambient thermal characterization parameter, ΨJA, is comprised of ΨJS, which
includes the thermal interface material thermal characterization parameter, and of ΨSA, the sink-to-
local ambient thermal characterization parameter:
Where:
ΨJS = Thermal characterization parameter from junction-to-sink, this also includes thermal resistance
of the thermal interface material (ΨTIM) (°C/W).
ΨSA = Thermal characterization parameter from sink-to-local ambient (°C/W)
ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink to the
local ambient air. ΨSA is dependent on the heatsink material, thermal conductivity , and geometry. It is
also strongly dependent on the air velocity through the fins of the heatsink. Figure 5 illustrates the
combination of the different thermal characterization parameters.
Equation 1. Junction-to-Local Ambient Thermal Characterization Parameter (ΨJA)
Equation 2. Junction-to-Local Ambient Thermal Characterization Parameter

TDP

TT AJ
JA

=Ψ

ΨJA = ΨJS + ΨSA