Sony MDS-NT1 service manual Notes on chip component replacement, Flexible Circuit Board Repairing

Models: MDS-NT1

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Notes on chip component replacement

MDS-NT1

The laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the bottom exterior.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

Notes on chip component replacement

Never reuse a disconnected chip component.

Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

Flexible Circuit Board Repairing

Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.

Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN

THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

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Sony MDS-NT1 service manual Notes on chip component replacement, Flexible Circuit Board Repairing